*SPICE model for MSA0686 *Start Package model .SUBCKT MSA0686 OUT IN GND * PI NETWORK TO SIMULATE TRANSMISSION LINE T1 C1T1 11 0 .059PF LT1 11 12 .493NH C2T1 12 0 .059PF * PI NETWORK TO SIMULATE TRANSMISSION LINE T2 C1T2 14 0 .042PF LT2 14 15 .076NH C2T2 15 0 .042PF * PI NETWORK TO SIMULATE TRANSMISSION LINE T3 C1T3 13 0 .039PF LT3 13 DIEOUT .330NH C2T3 DIEOUT 0 .039PF * Bond wire inductance LLB 12 DIEIN .55NH LLE 15 DIEGND .1NH * Contact inductance LL1 IN 11 .55NH LL2 GND 14 .06NH LL3 OUT 13 .25NH *Parasitic capacitances CCEB 12 15 .02PF CCEC 15 DIEOUT .03PF CCBC 12 DIEOUT .03PF * INSERT DIE MODEL XA06DIE DIEOUT DIEIN DIEGND MSA06 .ENDS *end Package model * * Start die model .SUBCKT MSA06 DIEOUT DIEIN DIEGND RF DIEIN DIEOUT 600 RB DIEIN DIEGND 480 RBIAS Q1E DIEGND 157 RE Q2E DIEGND 0 CF DIEIN DIEOUT 0.083PF CP1 Q1E DIEOUT 0.019PF CP2 Q2E DIEOUT 0.010PF CP3 DIEGND DIEOUT 0.085PF XA06Q1 DIEOUT DIEIN Q1E A06Q1 XA06Q2 DIEOUT Q1E Q2E A06Q2 .ENDS * Q1 distributed base model .SUBCKT A06Q1 Q1C Q1B Q1E RB1 Q1B 11 .095 RB2 11 12 3.26 RB3 12 B1 2.83 RE E1 Q1E 0.22 RC C1 Q1C 10 Q1 C1 B1 E1 QMSA 438 DCD1 Q1B C1 DMOD 782 DCD2 11 C1 DMOD 609 DCD3 12 C1 DMOD 386 .ENDS * Q2 distributed base model .SUBCKT A06Q2 Q2C Q2B Q2E RB1 Q2B 21 0.95 RB2 21 22 3.26 RB3 22 B2 2.83 RE E2 Q2E 0.22 RC C2 Q2C 10 Q1 C2 B2 E2 QMSA 438 DCD1 Q2B C2 DMOD 782 DCD2 21 C2 DMOD 609 DCD3 22 C2 DMOD 386 .ENDS * DIODE AND TRANSISTOR MODELS USED IN AGILENT TECHNOLOGIES MMICS AND DISCRETES .MODEL DMOD D(IS=1E-25, CJO=2.45E-16, VJ=.76, M=.53, BV=45, IBV=1E-9) .MODEL QMSA NPN (BF=90, BR=5, IS=1.65E-18, VA=20, TF=12PS, + CJE=1.8E-15, VJE=1.01, MJE=0.6, PTF=25, XTB=1.818, + VTF=6, ITF=3E-4, IKF=1.333E-4, XTF=4, NF=1.03, ISE=5E-15, + NE=2.5) *end Die model