(kicad_pcb (version 20171130) (host pcbnew 5.0.2+dfsg1-1)
  (general
    (thickness 1.6)
    (drawings 65)
    (tracks 474)
    (zones 0)
    (modules 38)
    (nets 44)
  )
  (page A4)
  (title_block
    (title IRUSB)
    (rev 1.0)
    (company "(c) 2020 by Malte Marwedel")
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.5)
    (trace_clearance 0.2)
    (zone_clearance 0.45)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 0.8 0.8)
    (pad_drill 0.8)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 "Net-(R7-Pad1)")
  (net 2 "Net-(J1-Pad3)")
  (net 3 +3V3)
  (net 4 "Net-(J2-Pad5)")
  (net 5 "Net-(D1-Pad2)")
  (net 6 GND)
  (net 7 "Net-(J4-Pad2)")
  (net 8 "Net-(D2-Pad2)")
  (net 9 +5V)
  (net 10 "Net-(R6-Pad1)")
  (net 11 "Net-(D2-Pad1)")
  (net 12 "Net-(C3-Pad1)")
  (net 13 "Net-(C4-Pad1)")
  (net 14 /SPI1_NSS)
  (net 15 /SPI1_SCK)
  (net 16 /SPI1_MISO)
  (net 17 /SPI1_MOSI)
  (net 18 "Net-(U2-Pad15)")
  (net 19 "Net-(J1-Pad2)")
  (net 20 /SWDIO)
  (net 21 /SWCLK)
  (net 22 "Net-(U2-Pad27)")
  (net 23 "Net-(U2-Pad28)")
  (net 24 "Net-(U2-Pad29)")
  (net 25 "Net-(U2-Pad30)")
  (net 26 "Net-(J1-Pad6)")
  (net 27 "Net-(J1-Pad4)")
  (net 28 "Net-(J2-Pad1)")
  (net 29 "Net-(J2-Pad6)")
  (net 30 "Net-(C8-Pad1)")
  (net 31 "Net-(D4-Pad2)")
  (net 32 "Net-(D3-Pad1)")
  (net 33 /TIM2_CH1)
  (net 34 /TIM2_CH2)
  (net 35 /USART2_TX)
  (net 36 /USART2_RX)
  (net 37 /USART1_CK)
  (net 38 /USART1_TX)
  (net 39 /USART1_RX)
  (net 40 "Net-(U2-Pad14)")
  (net 41 "Net-(C10-Pad2)")
  (net 42 /USB_DP)
  (net 43 /USB_DM)
  (net_class Default "Dies ist die voreingestellte Netzklasse."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net +5V)
    (add_net /SPI1_MISO)
    (add_net /SPI1_MOSI)
    (add_net /SPI1_NSS)
    (add_net /SPI1_SCK)
    (add_net /SWCLK)
    (add_net /SWDIO)
    (add_net /TIM2_CH1)
    (add_net /TIM2_CH2)
    (add_net /USART1_CK)
    (add_net /USART1_RX)
    (add_net /USART1_TX)
    (add_net /USART2_RX)
    (add_net /USART2_TX)
    (add_net /USB_DM)
    (add_net /USB_DP)
    (add_net GND)
    (add_net "Net-(C10-Pad2)")
    (add_net "Net-(C3-Pad1)")
    (add_net "Net-(C4-Pad1)")
    (add_net "Net-(C8-Pad1)")
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(D3-Pad1)")
    (add_net "Net-(D4-Pad2)")
    (add_net "Net-(J1-Pad2)")
    (add_net "Net-(J1-Pad3)")
    (add_net "Net-(J1-Pad4)")
    (add_net "Net-(J1-Pad6)")
    (add_net "Net-(J2-Pad1)")
    (add_net "Net-(J2-Pad5)")
    (add_net "Net-(J2-Pad6)")
    (add_net "Net-(J4-Pad2)")
    (add_net "Net-(R6-Pad1)")
    (add_net "Net-(R7-Pad1)")
    (add_net "Net-(U2-Pad14)")
    (add_net "Net-(U2-Pad15)")
    (add_net "Net-(U2-Pad27)")
    (add_net "Net-(U2-Pad28)")
    (add_net "Net-(U2-Pad29)")
    (add_net "Net-(U2-Pad30)")
  )
  (net_class Thick ""
    (clearance 0.2)
    (trace_width 0.5)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
  )
  (module MalteM:USB_Micro-B_Amtek-MIUSB-F5M-BBX-U_Handsolder (layer F.Cu) (tedit 5F911F41)
    (at 150 100)
    (descr https://www.google.de/url?sa=t&rct=j&q=&esrc=s&source=web&cd=&cad=rja&uact=8&ved=2ahUKEwitj4vkgarsAhWqNOwKHbm-CJwQFjAEegQIAhAC&url=https%3A%2F%2Famtek-co.com.tw%2Fwp-content%2Fuploads%2F2019%2F08%2FMiniMicro-USB_compressed.pdf&usg=AOvVaw2SGsOt0LFmtKhGWBrR4z_M)
    (tags "Micro-USB SMD Typ-B 5UR2B06MF-105XXBUHM1")
    (attr smd)
    (fp_text reference J1 (at 0 -5.1) (layer F.SilkS))
    (fp_text value USB_B_Micro (at 0.3 4.3375) (layer F.Fab))
    (fp_text user "PCB Edge" (at 0 2) (layer Dwgs.User))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 6 smd rect (at 1.15 0.04) (size 1.8 1.9) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(J1-Pad6)"))
    (pad "" np_thru_hole circle (at -1.91 -2.11) (size 0.8 0.8) (drill 0.8) (layers *.Cu *.Mask)
      (clearance 0.01))
    (pad 2 smd rect (at -0.65 -3.11) (size 0.4 2.35) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(J1-Pad2)"))
    (pad 1 smd rect (at -1.3 -3.11) (size 0.4 2.35) (layers F.Cu F.Paste F.Mask)
      (net 9 +5V))
    (pad 5 smd rect (at 1.3 -3.11) (size 0.4 2.35) (layers F.Cu F.Paste F.Mask)
      (net 6 GND))
    (pad 4 smd rect (at 0.65 -3.11) (size 0.4 2.35) (layers F.Cu F.Paste F.Mask)
      (net 27 "Net-(J1-Pad4)"))
    (pad 3 smd rect (at 0 -3.11) (size 0.4 2.35) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(J1-Pad3)"))
    (pad "" np_thru_hole circle (at 1.91 -2.11) (size 0.8 0.8) (drill 0.8) (layers *.Cu *.Mask)
      (clearance 0.01))
    (pad 6 smd rect (at -1.15 0.04) (size 1.8 1.9) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(J1-Pad6)"))
    (pad 6 smd rect (at 4 0.04) (size 1.8 1.9) (layers F.Cu F.Mask)
      (net 26 "Net-(J1-Pad6)"))
    (pad 6 smd rect (at -4 0.04) (size 1.8 1.9) (layers F.Cu F.Mask)
      (net 26 "Net-(J1-Pad6)"))
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex-105017-0001.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex_47346-0001.wrl
      (offset (xyz 0 1 0))
      (scale (xyz 1 1.25 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6_Handsoldering (layer B.Cu) (tedit 5A02FF57)
    (at 150.75 94.25 270)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U3 (at 0 -2.5 270) (layer B.SilkS))
    (fp_text value USBLC6-2SC6 (at 0 -2.9 270) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -1.35 0.95 270) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 43 /USB_DM))
    (pad 2 smd rect (at -1.35 0 270) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 6 GND))
    (pad 3 smd rect (at -1.35 -0.95 270) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 42 /USB_DP))
    (pad 4 smd rect (at 1.35 -0.95 270) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 2 "Net-(J1-Pad3)"))
    (pad 6 smd rect (at 1.35 0.95 270) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(J1-Pad2)"))
    (pad 5 smd rect (at 1.35 0 270) (size 1.56 0.65) (layers B.Cu B.Paste B.Mask)
      (net 9 +5V))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23W_Handsoldering (layer B.Cu) (tedit 5A02FF57)
    (at 146.7 88.3335 90)
    (descr "SOT-23W http://www.allegromicro.com/~/media/Files/Datasheets/A112x-Datasheet.ashx?la=en&hash=7BC461E058CC246E0BAB62433B2F1ECA104CA9D3")
    (tags "SOT-23W for handsoldering")
    (attr smd)
    (fp_text reference U1 (at 0 2.5 90) (layer B.SilkS))
    (fp_text value MCP1754-3302E_SOT89 (at 0 -2.5 90) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -1.7 0.95 90) (size 2 0.7) (layers B.Cu B.Paste B.Mask)
      (net 9 +5V))
    (pad 2 smd rect (at -1.7 -0.95 90) (size 2 0.7) (layers B.Cu B.Paste B.Mask)
      (net 6 GND))
    (pad 3 smd rect (at 1.7 0 90) (size 2 0.7) (layers B.Cu B.Paste B.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23W_Handsoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 157 83.5)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J4 (at 0 4.75 90) (layer F.SilkS))
    (fp_text value Conn_01x02_Male (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 "Net-(J4-Pad2)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TestPoint:TestPoint_2Pads_Pitch2.54mm_Drill0.8mm (layer F.Cu) (tedit 5A0F774F)
    (at 143 84.75 90)
    (descr "Test point with 2 pins, pitch 2.54mm, drill diameter 0.8mm")
    (tags "CONN DEV")
    (attr virtual)
    (fp_text reference J5 (at 4.75 0 90) (layer F.SilkS))
    (fp_text value Conn_01x02_Male (at 1.27 2 90) (layer F.Fab))
    (fp_text user %R (at 1.3 -2 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 9 +5V))
    (pad 2 thru_hole circle (at 2.54 0 90) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 6 GND))
  )
  (module Connector_PinSocket_2.54mm:PinSocket_1x03_P2.54mm_Vertical (layer F.Cu) (tedit 5A19A429)
    (at 139.25 93.5 180)
    (descr "Through hole straight socket strip, 1x03, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 1x03 2.54mm single row")
    (fp_text reference J3 (at -2.5 -0.75 270) (layer F.SilkS))
    (fp_text value Conn_01x03_Male (at 0 7.85 180) (layer F.Fab))
    (fp_text user %R (at 0 2.54 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 GND))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 39 /USART1_RX))
    (pad 3 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 38 /USART1_TX))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinSocket_2.54mm:PinSocket_1x08_P2.54mm_Vertical (layer F.Cu) (tedit 5A19A420)
    (at 141.09 68.5 90)
    (descr "Through hole straight socket strip, 1x08, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 1x08 2.54mm single row")
    (fp_text reference J7 (at 2.25 -1.09 90) (layer F.SilkS))
    (fp_text value Conn_01x08_Male (at 0 20.55 90) (layer F.Fab))
    (fp_text user %R (at 0 8.89 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 /USART1_CK))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 /SPI1_MOSI))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 /SPI1_MISO))
    (pad 4 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /SPI1_SCK))
    (pad 5 thru_hole oval (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 /SPI1_NSS))
    (pad 6 thru_hole oval (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 41 "Net-(C10-Pad2)"))
    (pad 7 thru_hole oval (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 /USART2_TX))
    (pad 8 thru_hole oval (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 34 /TIM2_CH2))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x08_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TestPoint:TestPoint_2Pads_Pitch2.54mm_Drill0.8mm (layer F.Cu) (tedit 5A0F774F)
    (at 139.25 84.75 90)
    (descr "Test point with 2 pins, pitch 2.54mm, drill diameter 0.8mm")
    (tags "CONN DEV")
    (attr virtual)
    (fp_text reference J6 (at 4.75 2.5 90) (layer F.SilkS))
    (fp_text value Conn_01x02_Male (at 1.27 2 90) (layer F.Fab))
    (fp_text user %R (at 1.3 -2 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 2 thru_hole circle (at 2.54 0 90) (size 1.4 1.4) (drill 0.8) (layers *.Cu *.Mask)
      (net 6 GND))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer F.Cu) (tedit 5A3F8BB2)
    (at 154.5 64.25 90)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP2 (at 1.25 -1.8 90) (layer F.SilkS))
    (fp_text value SolderJumper_3_Open (at 0 2 90) (layer F.Fab))
    (pad 3 smd rect (at 1.3 0 90) (size 1 1.5) (layers F.Cu F.Mask)
      (net 6 GND))
    (pad 2 smd rect (at 0 0 90) (size 1 1.5) (layers F.Cu F.Mask)
      (net 41 "Net-(C10-Pad2)"))
    (pad 1 smd rect (at -1.3 0 90) (size 1 1.5) (layers F.Cu F.Mask)
      (net 36 /USART2_RX))
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 151.25 65.25)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at -0.75 -2 180) (layer F.SilkS))
    (fp_text value 4,7µF (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 14 /SPI1_NSS))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 41 "Net-(C10-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystal:Crystal_HC49-U_Vertical (layer F.Cu) (tedit 5A1AD3B8)
    (at 152.5 77.5 180)
    (descr "Crystal THT HC-49/U http://5hertz.com/pdfs/04404_D.pdf")
    (tags "THT crystalHC-49/U")
    (fp_text reference Y1 (at 9 0 180) (layer F.SilkS))
    (fp_text value 8MHz (at 2.44 3.525 180) (layer F.Fab))
    (fp_text user %R (at 2.44 0 180) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask)
      (net 12 "Net-(C3-Pad1)"))
    (pad 2 thru_hole circle (at 4.88 0 180) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask)
      (net 13 "Net-(C4-Pad1)"))
    (model ${KISYS3DMOD}/Crystal.3dshapes/Crystal_HC49-4H_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 161.75 84.525 90)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D4 (at -2.975 0.25 90) (layer F.SilkS))
    (fp_text value LED-red (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 31 "Net-(D4-Pad2)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_THT:LED_D5.0mm_IRGrey (layer F.Cu) (tedit 5A6C9BB8)
    (at 155.25 57.25 270)
    (descr "LED, diameter 5.0mm, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LL-504BC2E-009.pdf")
    (tags "LED diameter 5.0mm 2 pins")
    (fp_text reference D3 (at -0.75 3.75 270) (layer F.SilkS))
    (fp_text value TSUS2540 (at 1.27 3.96 270) (layer F.Fab))
    (fp_text user %R (at 1.25 0 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 32 "Net-(D3-Pad1)"))
    (pad 2 thru_hole circle (at 2.54 0 270) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 11 "Net-(D2-Pad1)"))
    (model ${KISYS3DMOD}/LED_THT.3dshapes/LED_D5.0mm_IRGrey.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 150 59.9875 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 3.4875 0 90) (layer F.SilkS))
    (fp_text value 18 (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 30 "Net-(C8-Pad1)"))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 8 "Net-(D2-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 143.75 88.475 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 1.525 2 270) (layer B.SilkS))
    (fp_text value 10µF (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 152.275 79.75 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at -0.025 -1.75 180) (layer B.SilkS))
    (fp_text value 22pF (at 0 -1.65 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 12 "Net-(C3-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 147.725 79.75)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at -1.225 1.65) (layer B.SilkS))
    (fp_text value 22pF (at 0.025 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 13 "Net-(C4-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 143.25 92.75 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 1 -1.75 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 153.25 82.25 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -0.5 -1.5 180) (layer F.SilkS))
    (fp_text value 100nF (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 149.5 82.25 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 0.25 1.5 270) (layer F.SilkS))
    (fp_text value 100nF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 146.75 92.75 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 3 0 180) (layer B.SilkS))
    (fp_text value 10µF (at 0 -1.65 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 9 +5V))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 144.5 64.2375 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at -1.9875 1.75 90) (layer F.SilkS))
    (fp_text value 22µF (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 30 "Net-(C8-Pad1)"))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 6 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 147 64.25 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at 0 -1.82 270) (layer F.SilkS))
    (fp_text value 22µF (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 6 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 30 "Net-(C8-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 156.37 72.5 270)
    (descr "Through hole straight pin header, 1x06, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x06 2.54mm single row")
    (fp_text reference J2 (at 0.5 -2.38 270) (layer F.SilkS))
    (fp_text value Conn_01x06_Male (at 0 15.03 270) (layer F.Fab))
    (fp_text user %R (at 0 6.35) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 "Net-(J2-Pad1)"))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 /SWCLK))
    (pad 3 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 GND))
    (pad 4 thru_hole oval (at 0 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 /SWDIO))
    (pad 5 thru_hole oval (at 0 10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 "Net-(J2-Pad5)"))
    (pad 6 thru_hole oval (at 0 12.7 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 "Net-(J2-Pad6)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x06_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5A3EABFC)
    (at 145.7 98.15 90)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP1 (at 1.4 2.3 180) (layer B.SilkS))
    (fp_text value SolderJumper_2_Open (at 0 -1.9 90) (layer B.Fab))
    (pad 2 smd rect (at 0.65 0 90) (size 1 1.5) (layers B.Cu B.Mask)
      (net 6 GND))
    (pad 1 smd rect (at -0.65 0 90) (size 1 1.5) (layers B.Cu B.Mask)
      (net 26 "Net-(J1-Pad6)"))
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 157.75 64.775 90)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D1 (at 2.275 -1.25 90) (layer F.SilkS))
    (fp_text value LED-green (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 5 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_THT:LED_D5.0mm_IRGrey (layer F.Cu) (tedit 5A6C9BB8)
    (at 144.75 57.25 270)
    (descr "LED, diameter 5.0mm, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LL-504BC2E-009.pdf")
    (tags "LED diameter 5.0mm 2 pins")
    (fp_text reference D2 (at -0.75 -4 270) (layer F.SilkS))
    (fp_text value TSUS2540 (at 1.27 3.96 270) (layer F.Fab))
    (fp_text user %R (at 1.25 0 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 11 "Net-(D2-Pad1)"))
    (pad 2 thru_hole circle (at 2.54 0 270) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 8 "Net-(D2-Pad2)"))
    (model ${KISYS3DMOD}/LED_THT.3dshapes/LED_D5.0mm_IRGrey.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_QFP:LQFP-32_7x7mm_P0.8mm (layer F.Cu) (tedit 5A02F146)
    (at 150 89.25 270)
    (descr "LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm (see NXP sot358-1_po.pdf and sot358-1_fr.pdf)")
    (tags "QFP 0.8")
    (attr smd)
    (fp_text reference U2 (at 0.75 -5.85 270) (layer F.SilkS))
    (fp_text value STM32F042K6Tx (at 0 5.85 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -4.25 -2.8 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at -4.25 -2 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(C3-Pad1)"))
    (pad 3 smd rect (at -4.25 -1.2 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(C4-Pad1)"))
    (pad 4 smd rect (at -4.25 -0.4 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(J2-Pad5)"))
    (pad 5 smd rect (at -4.25 0.4 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 6 smd rect (at -4.25 1.2 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 33 /TIM2_CH1))
    (pad 7 smd rect (at -4.25 2 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 34 /TIM2_CH2))
    (pad 8 smd rect (at -4.25 2.8 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 35 /USART2_TX))
    (pad 9 smd rect (at -2.8 4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 36 /USART2_RX))
    (pad 10 smd rect (at -2 4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 14 /SPI1_NSS))
    (pad 11 smd rect (at -1.2 4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 15 /SPI1_SCK))
    (pad 12 smd rect (at -0.4 4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 16 /SPI1_MISO))
    (pad 13 smd rect (at 0.4 4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 17 /SPI1_MOSI))
    (pad 14 smd rect (at 1.2 4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 40 "Net-(U2-Pad14)"))
    (pad 15 smd rect (at 2 4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(U2-Pad15)"))
    (pad 16 smd rect (at 2.8 4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 GND))
    (pad 17 smd rect (at 4.25 2.8 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 18 smd rect (at 4.25 2 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 37 /USART1_CK))
    (pad 19 smd rect (at 4.25 1.2 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 38 /USART1_TX))
    (pad 20 smd rect (at 4.25 0.4 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 39 /USART1_RX))
    (pad 21 smd rect (at 4.25 -0.4 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 43 /USB_DM))
    (pad 22 smd rect (at 4.25 -1.2 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 42 /USB_DP))
    (pad 23 smd rect (at 4.25 -2 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 20 /SWDIO))
    (pad 24 smd rect (at 4.25 -2.8 270) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 21 /SWCLK))
    (pad 25 smd rect (at 2.8 -4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(R6-Pad1)"))
    (pad 26 smd rect (at 2 -4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(R7-Pad1)"))
    (pad 27 smd rect (at 1.2 -4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 22 "Net-(U2-Pad27)"))
    (pad 28 smd rect (at 0.4 -4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 23 "Net-(U2-Pad28)"))
    (pad 29 smd rect (at -0.4 -4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(U2-Pad29)"))
    (pad 30 smd rect (at -1.2 -4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 25 "Net-(U2-Pad30)"))
    (pad 31 smd rect (at -2 -4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(J4-Pad2)"))
    (pad 32 smd rect (at -2.8 -4.25) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 GND))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/LQFP-32_7x7mm_P0.8mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23_Handsoldering (layer F.Cu) (tedit 5A0AB76C)
    (at 160.75 58 90)
    (descr "SOT-23, Handsoldering")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q1 (at 1.75 -1.75 90) (layer F.SilkS))
    (fp_text value IRLML6344 (at 0 2.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -0.95 90) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 33 /TIM2_CH1))
    (pad 2 smd rect (at -1.5 0.95 90) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 6 GND))
    (pad 3 smd rect (at 1.5 0 90) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 32 "Net-(D3-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 160.725 81.25)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at -2.475 -0.75 90) (layer F.SilkS))
    (fp_text value 1k (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 31 "Net-(D4-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 10 "Net-(R6-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 141.75 64.75 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0.75 -1.75 90) (layer F.SilkS))
    (fp_text value 3.3 (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 +5V))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 30 "Net-(C8-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 160.775 62.5)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at -0.525 -1.5) (layer F.SilkS))
    (fp_text value 100k (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 33 /TIM2_CH1))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 160 84.5 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 1.65 90) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 6 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 7 "Net-(J4-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 160.75 64.5 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 -1.65 180) (layer F.SilkS))
    (fp_text value 1k (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 5 "Net-(D1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 142.75 76.475 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 0.025 -1.75 270) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(J2-Pad5)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 154.525 91.75 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at 0 1.65 180) (layer B.SilkS))
    (fp_text value 1,5k (at 0 -1.65 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 42 /USB_DP))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 "Net-(R7-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_2.5mm_Pad (layer F.Cu) (tedit 5F84A28F)
    (at 159.75 90.5)
    (descr "Mounting Hole 2.5mm")
    (tags "mounting hole 2.5mm")
    (attr virtual)
    (fp_text reference H1 (at -3 1.75) (layer F.SilkS))
    (fp_text value MountingHole_Pad (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.5) (layers *.Cu *.Mask)
      (net 6 GND))
  )
  (module MountingHole:MountingHole_2.5mm_Pad (layer F.Cu) (tedit 5F84A2BB)
    (at 140.25 60)
    (descr "Mounting Hole 2.5mm")
    (tags "mounting hole 2.5mm")
    (attr virtual)
    (fp_text reference H2 (at 0 -3.5) (layer F.SilkS))
    (fp_text value MountingHole_Pad (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2.5) (layers *.Cu *.Mask)
      (net 6 GND))
  )
  (gr_text "CC BY-SA 3.0 DE" (at 160.75 61.75 90) (layer B.SilkS))
  (gr_text 1CK (at 141.25 70.5) (layer F.SilkS))
  (gr_text CH2 (at 158.5 70.5) (layer F.SilkS))
  (gr_text 2RX (at 153.75 70.5) (layer F.SilkS))
  (gr_text 2TX (at 156.25 70.5) (layer F.SilkS))
  (gr_text NSS (at 151.25 70.5) (layer F.SilkS))
  (gr_text SCK (at 148.75 70.5) (layer F.SilkS))
  (gr_text MISO (at 146.25 70.5) (layer F.SilkS))
  (gr_text MOSI (at 143.5 70.5) (layer F.SilkS))
  (gr_text CLK (at 153.5 74.5) (layer F.SilkS))
  (gr_text IO (at 148.75 74.5) (layer F.SilkS))
  (gr_text "⏚\n" (at 150.5 74.5) (layer F.SilkS))
  (gr_text 3.3V (at 140.25 84.75) (layer F.SilkS))
  (gr_text "⏚\n" (at 144 82.25) (layer F.SilkS))
  (gr_text PA15 (at 160 85 90) (layer F.SilkS))
  (gr_text PA0 (at 158.25 59 90) (layer F.SilkS))
  (gr_text PA1 (at 161.5 70.25 90) (layer F.SilkS))
  (gr_text PA8 (at 138.5 70.25 90) (layer F.SilkS))
  (gr_text R (at 146.25 74.5) (layer F.SilkS))
  (gr_text V0.9 (at 154 96) (layer F.SilkS))
  (gr_text 5V (at 144 84.75) (layer F.SilkS))
  (gr_text "⏚\n" (at 140.25 82.25) (layer F.SilkS))
  (gr_text SWD (at 143.25 74.75) (layer F.SilkS))
  (gr_text "1TX\n1RX\n⏚" (at 140.75 90.25) (layer F.SilkS))
  (gr_text BOOT (at 156.75 79 90) (layer F.SilkS))
  (gr_text "Malte Marwedel" (at 149 64.5) (layer B.Cu))
  (gr_text "© 2020" (at 150 62.5) (layer B.Cu))
  (gr_text IRUSB (at 150 57.75) (layer B.Cu))
  (gr_text IRUSB (at 157 94.25) (layer F.SilkS))
  (gr_line (start 163 55) (end 163 70.75) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 163 79.75) (end 159.5 79.75) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 159.5 70.75) (end 159.5 79.75) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 159.5 70.75) (end 163 70.75) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 137 70.75) (end 137 55) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 140.5 79.75) (end 137 79.75) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 140.5 70.75) (end 140.5 79.75) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 137 70.75) (end 140.5 70.75) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 137 95.5) (end 137 79.75) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 143 95.5) (end 137 95.5) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 143 101.5) (end 143 95.5) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 143 101.5) (end 157 101.5) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 157 95.5) (end 157 101.5) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 163 95.5) (end 157 95.5) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 163 79.75) (end 163 95.5) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 137 55) (end 163 55) (layer Edge.Cuts) (width 0.2))
  (zone (net 6) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.45))
    (min_thickness 0.25)
    (fill yes (arc_segments 16) (thermal_gap 0.5) (thermal_bridge_width 0.5))
    (polygon
      (pts
        (xy 162.75 55.25) (xy 162.75 70.5) (xy 159.25 70.5) (xy 159.25 80) (xy 162.75 80)
        (xy 162.75 95.25) (xy 156.75 95.25) (xy 156.75 101.25) (xy 143.25 101.25) (xy 143.25 95.25)
        (xy 137.25 95.25) (xy 137.25 80) (xy 140.75 80) (xy 140.75 70.5) (xy 137.25 70.5)
        (xy 137.25 55.25)
      )
    )
  )
  (zone (net 6) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.45))
    (min_thickness 0.25)
    (fill yes (arc_segments 16) (thermal_gap 0.5) (thermal_bridge_width 0.5))
    (polygon
      (pts
        (xy 137.25 55.25) (xy 162.75 55.25) (xy 162.75 70.5) (xy 159.25 70.5) (xy 159.25 80)
        (xy 162.75 80) (xy 162.75 95.25) (xy 156.75 95.25) (xy 156.75 101.25) (xy 143.25 101.25)
        (xy 143.25 95.25) (xy 137.25 95.25) (xy 137.25 80) (xy 140.75 80) (xy 140.75 70.5)
        (xy 137.25 70.5)
      )
    )
  )
)
