(kicad_pcb (version 20171130) (host pcbnew "(5.1.2)-2")
  (general
    (thickness 1.6)
    (drawings 12)
    (tracks 261)
    (zones 0)
    (modules 45)
    (nets 25)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.3)
    (user_trace_width 0.5)
    (user_trace_width 1)
    (user_trace_width 2)
    (user_trace_width 3)
    (trace_clearance 0.2)
    (zone_clearance 0.2)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (user_via 0.5 0.4)
    (user_via 1 0.5)
    (user_via 2 1)
    (user_via 3 2)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.1)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 2.7 5)
    (pad_drill 0)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerberV3/"))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 VBUS)
  (net 3 FB)
  (net 4 "Net-(C5-Pad1)")
  (net 5 "Net-(C6-Pad1)")
  (net 6 "Net-(C7-Pad1)")
  (net 7 BIAS)
  (net 8 "Net-(CIN1-Pad1)")
  (net 9 VPP)
  (net 10 "Net-(CSS1-Pad1)")
  (net 11 "Net-(D1-Pad1)")
  (net 12 "Net-(D2-Pad1)")
  (net 13 "Net-(J6-Pad1)")
  (net 14 "Net-(J7-Pad1)")
  (net 15 "Net-(L2-Pad1)")
  (net 16 EN)
  (net 17 "Net-(R5-Pad2)")
  (net 18 "Net-(R8-Pad2)")
  (net 19 VC)
  (net 20 "Net-(R12-Pad2)")
  (net 21 "Net-(RT1-Pad2)")
  (net 22 "Net-(U1-Pad28)")
  (net 23 SYNC)
  (net 24 "Net-(U1-Pad11)")
  (net_class Default "Dies ist die voreingestellte Netzklasse."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net BIAS)
    (add_net EN)
    (add_net FB)
    (add_net GND)
    (add_net "Net-(C5-Pad1)")
    (add_net "Net-(C6-Pad1)")
    (add_net "Net-(C7-Pad1)")
    (add_net "Net-(CIN1-Pad1)")
    (add_net "Net-(CSS1-Pad1)")
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(J6-Pad1)")
    (add_net "Net-(J7-Pad1)")
    (add_net "Net-(L2-Pad1)")
    (add_net "Net-(R12-Pad2)")
    (add_net "Net-(R5-Pad2)")
    (add_net "Net-(R8-Pad2)")
    (add_net "Net-(RT1-Pad2)")
    (add_net "Net-(U1-Pad11)")
    (add_net "Net-(U1-Pad28)")
    (add_net SYNC)
    (add_net VBUS)
    (add_net VC)
    (add_net VPP)
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 56D1B4CB)
    (at 68.7705 146.19986)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at 3.7211 2.33172) (layer F.SilkS))
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 56D1B4CB)
    (at 136.21512 103.76154)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at -4.66344 0.09144) (layer F.SilkS))
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 56D1B4CB)
    (at 136.26592 146.24812)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at -4.84378 2.5273) (layer F.SilkS))
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 56D1B4CB)
    (at 68.75526 103.7209)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at 4.08178 -2.32918) (layer F.SilkS))
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 77.60716 144.74444 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R13 (at 0 -1.82 90) (layer F.SilkS))
    (fp_text value 43k (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 20 "Net-(R12-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 84.24418 146.0754)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R11 (at 0.10414 2.16916) (layer F.SilkS))
    (fp_text value 0R (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 VBUS))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 7 BIAS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 81.00568 119.53748 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at 0.06858 -1.68402 90) (layer F.SilkS))
    (fp_text value 7.5k (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 "Net-(D2-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 80.86852 131.74726 180)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 0 -1.82) (layer F.SilkS))
    (fp_text value 43k (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 18 "Net-(R8-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 FB))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 75.25512 110.11248 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at -1.34206 -2.0193 90) (layer F.SilkS))
    (fp_text value 7.5k (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 4 "Net-(C5-Pad1)"))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 13 "Net-(J6-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 81.03362 125.73508 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 3.30708 -0.0508 90) (layer F.SilkS))
    (fp_text value 43k (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 FB))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 "Net-(D2-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 85.41004 125.86462 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0 -1.82 90) (layer F.SilkS))
    (fp_text value 0R (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 17 "Net-(R5-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 FB))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 85.4202 131.87426 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at -3.26644 0.10414 90) (layer F.SilkS))
    (fp_text value 1M (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 FB))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 VBUS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 119.51208 119.2403 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 -1.82 90) (layer F.SilkS))
    (fp_text value 0R (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 8 "Net-(CIN1-Pad1)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 9 VPP))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 91.40444 113.00968 180)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 -1.82) (layer F.SilkS))
    (fp_text value 0R (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 11 "Net-(D1-Pad1)"))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 16 EN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 80.38084 147.0152 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R12 (at -1.69926 -2.92608 180) (layer F.SilkS))
    (fp_text value 7.5k (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 20 "Net-(R12-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 7 BIAS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 97.8789 113.21796 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at 0 -1.82 90) (layer F.SilkS))
    (fp_text value 7.5k (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 6 "Net-(C7-Pad1)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 19 VC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 104.0765 113.96726 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RT1 (at -0.18796 -2.68224 90) (layer F.SilkS))
    (fp_text value 43k (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 21 "Net-(RT1-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 90.19286 121.9454)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 -1.82) (layer F.SilkS))
    (fp_text value 1M (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 9 VPP))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 11 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 109.96676 121.29356 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CIN2 (at 0 -2.28 90) (layer F.SilkS))
    (fp_text value 4.7µ/100V (at 0 2.28 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 9 VPP))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 125.71476 111.89208 180)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CIN1 (at 0 -2.28) (layer F.SilkS))
    (fp_text value 4.7µ/100V (at 0 2.28) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 8 "Net-(CIN1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 93.11894 117.76964 180)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 0 -2.28) (layer F.SilkS))
    (fp_text value 0.47µ/100V (at 0 2.28) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 "Net-(C6-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 109.98962 136.3234 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at -3.78046 -0.0508 90) (layer F.SilkS))
    (fp_text value 47µ/50V (at 0 2.28 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 113.98758 136.37928 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at -3.38676 0.17018 90) (layer F.SilkS))
    (fp_text value 47µ/50V (at 0 2.28 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 97.92208 108.59008 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 0 -1.65 90) (layer F.SilkS))
    (fp_text value 330p/50V (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 "Net-(C7-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 100.7999 113.96726 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CSS1 (at 4.06146 0.03556 90) (layer F.SilkS))
    (fp_text value 10n/25V (at 0 2.28 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 10 "Net-(CSS1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-223-3_TabPin2 (layer F.Cu) (tedit 5A02FF57)
    (at 82.92338 140.16228 90)
    (descr "module CMS SOT223 4 pins")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference U2 (at 0 -4.5 90) (layer F.SilkS))
    (fp_text value LM317_3PinPackage (at 0 4.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -3.15 -2.3 90) (size 2 1.5) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(R12-Pad2)"))
    (pad 3 smd rect (at -3.15 2.3 90) (size 2 1.5) (layers F.Cu F.Paste F.Mask)
      (net 2 VBUS))
    (pad 2 smd rect (at -3.15 0 90) (size 2 1.5) (layers F.Cu F.Paste F.Mask)
      (net 7 BIAS))
    (pad 2 smd rect (at 3.15 0 90) (size 2 3.8) (layers F.Cu F.Paste F.Mask)
      (net 7 BIAS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-223.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_DFN_QFN:LQFN-32_EP_4x6_Pitch0.5mm (layer F.Cu) (tedit 5F8FCEE4)
    (at 100.56622 120.65254)
    (descr "LQFN-32_EP_4x6_0.95mm(https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfn/05081512_C_lqfn32.pdf)")
    (tags LQFN)
    (attr smd)
    (fp_text reference U1 (at 1.60274 -4.2037) (layer F.SilkS))
    (fp_text value LT8646S (at 0 4.7) (layer F.Fab))
    (pad 37 smd rect (at -0.6625 1.44) (size 1.125 1.34) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_paste_margin -0.75))
    (pad 37 thru_hole circle (at -0.94625 1.12) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 37 thru_hole circle (at -0.94625 1.79) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 37 thru_hole circle (at -0.38375 1.12) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 37 thru_hole circle (at -0.38375 1.79) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 38 smd rect (at 0.6625 1.44) (size 1.125 1.34) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_paste_margin -0.75))
    (pad 38 thru_hole circle (at 0.40375 1.095) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 38 thru_hole circle (at 0.40375 1.765) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 38 thru_hole circle (at 0.96625 1.095) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 38 thru_hole circle (at 0.96625 1.765) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 36 smd rect (at 0.6625 0) (size 1.125 1.34) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_paste_margin -0.75))
    (pad 36 thru_hole circle (at 0.40375 -0.355) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 36 thru_hole circle (at 0.40375 0.315) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 36 thru_hole circle (at 0.96625 -0.355) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 36 thru_hole circle (at 0.96625 0.315) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 34 smd rect (at 0.6625 -1.44) (size 1.125 1.34) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_paste_margin -0.75))
    (pad 34 thru_hole circle (at 0.40375 -1.805) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 34 thru_hole circle (at 0.40375 -1.135) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 34 thru_hole circle (at 0.96625 -1.805) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 34 thru_hole circle (at 0.96625 -1.135) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad "" smd rect (at 1.875 2.875) (size 0.375 0.375) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at 1.875 -2.875) (size 0.375 0.375) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at -1.875 2.875) (size 0.375 0.375) (layers F.Cu F.Paste F.Mask))
    (pad 33 smd custom (at -0.6625 -1.44) (size 0.5625 0.67) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_paste_margin -0.75) (zone_connect 0)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 0.5625 0.67) (xy 0.5625 -0.67) (xy -0.28125 -0.67) (xy -0.5625 -0.35) (xy -0.5625 0.67)
) (width 0))
      ))
    (pad 33 thru_hole circle (at -0.94125 -1.775) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 33 thru_hole circle (at -0.94125 -1.105) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 33 thru_hole circle (at -0.37875 -1.775) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 33 thru_hole circle (at -0.37875 -1.105) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad "" smd rect (at -1.875 -2.875) (size 0.375 0.375) (layers F.Cu F.Paste F.Mask))
    (pad 35 thru_hole circle (at -0.38375 0.34) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 35 thru_hole circle (at -0.38375 -0.33) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 35 thru_hole circle (at -0.94625 0.34) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 35 thru_hole circle (at -0.94625 -0.33) (size 0.28125 0.28125) (drill 0.140625) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 35 smd rect (at -0.6625 0) (size 1.125 1.34) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (solder_paste_margin -0.75))
    (pad 32 smd rect (at -1.255 -2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 17 "Net-(R5-Pad2)"))
    (pad 31 smd rect (at -0.755 -2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(J7-Pad1)"))
    (pad 30 smd rect (at -0.255 -2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 19 VC))
    (pad 29 smd rect (at 0.245 -2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(CSS1-Pad1)"))
    (pad 28 smd rect (at 0.745 -2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 22 "Net-(U1-Pad28)"))
    (pad 27 smd rect (at 1.245 -2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 23 SYNC))
    (pad 26 smd rect (at 2 -2.26 270) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 21 "Net-(RT1-Pad2)"))
    (pad 25 smd rect (at 2 -1.76 270) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 16 EN))
    (pad 24 smd rect (at 2 -1.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 23 smd rect (at 2 -0.75 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 9 VPP))
    (pad 22 smd rect (at 2 -0.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 9 VPP))
    (pad 21 smd rect (at 2 0.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 9 VPP))
    (pad 20 smd rect (at 2 0.75 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 19 smd rect (at 2 1.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 18 smd rect (at 2 1.75 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 17 smd rect (at 2 2.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 16 smd rect (at 1.24 2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(L2-Pad1)"))
    (pad 15 smd rect (at 0.74 2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(L2-Pad1)"))
    (pad 14 smd rect (at 0.24 2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(L2-Pad1)"))
    (pad 13 smd rect (at -0.26 2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(L2-Pad1)"))
    (pad 12 smd rect (at -0.76 2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(L2-Pad1)"))
    (pad 11 smd rect (at -1.26 2.975) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(U1-Pad11)"))
    (pad 10 smd rect (at -2 2.3 270) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 9 smd rect (at -2 1.8 270) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 8 smd rect (at -2 1.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 7 smd rect (at -2 0.75 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at -2 0.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 9 VPP))
    (pad 5 smd rect (at -2 -0.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 9 VPP))
    (pad 4 smd rect (at -2 -0.75 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 9 VPP))
    (pad 3 smd rect (at -2 -1.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -2 -1.75 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(C6-Pad1)"))
    (pad 1 smd rect (at -2 -2.25 90) (size 0.25 0.85) (layers F.Cu F.Paste F.Mask)
      (net 7 BIAS))
  )
  (module Potentiometer_SMD:Potentiometer_Bourns_3269P_Horizontal (layer F.Cu) (tedit 5A3D7171)
    (at 70.55866 137.31494)
    (descr "Potentiometer, horizontal, Bourns 3269P, https://www.bourns.com/docs/Product-Datasheets/3269.pdf")
    (tags "Potentiometer horizontal Bourns 3269P")
    (attr smd)
    (fp_text reference RV1 (at 1.70688 5.71754) (layer F.SilkS))
    (fp_text value 200k (at 0 4.425) (layer F.Fab))
    (fp_text user %R (at -0.05 0) (layer F.Fab))
    (pad 3 smd rect (at 3.2 2.54) (size 3.3 1.19) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -3.2 0) (size 3.3 1.19) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at 3.2 -2.54) (size 3.3 1.19) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(R8-Pad2)"))
    (model ${KISYS3DMOD}/Potentiometer_SMD.3dshapes/Potentiometer_Bourns_3269P_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_Wuerth_HCM-1350 (layer F.Cu) (tedit 5FCDE0D0)
    (at 100.6602 137.87882 270)
    (descr "Inductor, Wuerth Elektronik, Wuerth_HCM-1350, 13.5mmx13.3mm")
    (tags "inductor Wuerth hcm smd")
    (attr smd)
    (fp_text reference L2 (at 0 -7.65 90) (layer F.SilkS))
    (fp_text value 4.7µ/R01 (at 0 8.15 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 5.45 0 270) (size 4 8) (layers F.Cu F.Paste F.Mask)
      (net 2 VBUS))
    (pad 1 smd rect (at -5.45 0 270) (size 4 8) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(L2-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_Wuerth_HCM-1350.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_Coilcraft_XAL5030 (layer F.Cu) (tedit 5FCDE102)
    (at 127.10414 119.45366 270)
    (descr L_Coilcraft_XAL5030)
    (tags "L Coilcraft XAL5030")
    (attr smd)
    (fp_text reference L1 (at 0 -3.81 90) (layer F.SilkS))
    (fp_text value 2.2µ (at 0 4.572 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 1.655 0 270) (size 2.7 5) (layers F.Cu F.Paste F.Mask)
      (net 9 VPP))
    (pad 1 smd rect (at -1.655 0 270) (size 2.7 5) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(CIN1-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_Coilcraft_XAL5030.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Wire:SolderWirePad_1x01_SMD_5x10mm (layer F.Cu) (tedit 5640A485)
    (at 85.3821 105.97642 90)
    (descr "Wire Pad, Square, SMD Pad,  5mm x 10mm,")
    (tags "MesurementPoint Square SMDPad 5mmx10mm ")
    (attr smd virtual)
    (fp_text reference J7 (at 0 -3.81 90) (layer F.SilkS))
    (fp_text value PG (at 0 6.35 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 5 10) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(J7-Pad1)"))
  )
  (module Connector_Wire:SolderWirePad_1x01_SMD_5x10mm (layer F.Cu) (tedit 5640A485)
    (at 70.16242 112.59058)
    (descr "Wire Pad, Square, SMD Pad,  5mm x 10mm,")
    (tags "MesurementPoint Square SMDPad 5mmx10mm ")
    (attr smd virtual)
    (fp_text reference J6 (at 0.90932 6.22554) (layer F.SilkS))
    (fp_text value TRIM (at 0 6.35) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at 0 0) (size 5 10) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(J6-Pad1)"))
  )
  (module Connector_Wire:SolderWirePad_1x01_SMD_5x10mm (layer F.Cu) (tedit 5640A485)
    (at 114.18316 105.85958 90)
    (descr "Wire Pad, Square, SMD Pad,  5mm x 10mm,")
    (tags "MesurementPoint Square SMDPad 5mmx10mm ")
    (attr smd virtual)
    (fp_text reference J5 (at 4.34086 -5.0927 90) (layer F.SilkS))
    (fp_text value VOUT- (at 0 6.35 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 5 10) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module Connector_Wire:SolderWirePad_1x01_SMD_5x10mm (layer F.Cu) (tedit 5640A485)
    (at 133.2865 139.84986 90)
    (descr "Wire Pad, Square, SMD Pad,  5mm x 10mm,")
    (tags "MesurementPoint Square SMDPad 5mmx10mm ")
    (attr smd virtual)
    (fp_text reference J4 (at -4.56184 -5.05968 90) (layer F.SilkS))
    (fp_text value VIN- (at 0 6.35 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 5 10) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module Connector_Wire:SolderWirePad_1x01_SMD_5x10mm (layer F.Cu) (tedit 5640A485)
    (at 121.14784 143.32458 270)
    (descr "Wire Pad, Square, SMD Pad,  5mm x 10mm,")
    (tags "MesurementPoint Square SMDPad 5mmx10mm ")
    (attr smd virtual)
    (fp_text reference J3 (at -3.91414 -4.63296 90) (layer F.SilkS))
    (fp_text value VOUT+ (at 0 6.35 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 270) (size 5 10) (layers F.Cu F.Paste F.Mask)
      (net 2 VBUS))
  )
  (module Connector_Wire:SolderWirePad_1x01_SMD_5x10mm (layer F.Cu) (tedit 5640A485)
    (at 135.2804 119.4943 180)
    (descr "Wire Pad, Square, SMD Pad,  5mm x 10mm,")
    (tags "MesurementPoint Square SMDPad 5mmx10mm ")
    (attr smd virtual)
    (fp_text reference J2 (at 2.06756 -6.68782) (layer F.SilkS))
    (fp_text value VIN+ (at 0 6.35) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at 0 0 180) (size 5 10) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(CIN1-Pad1)"))
  )
  (module Connector_Wire:SolderWirePad_1x01_SMD_5x10mm (layer F.Cu) (tedit 5640A485)
    (at 70.104 127.86868)
    (descr "Wire Pad, Square, SMD Pad,  5mm x 10mm,")
    (tags "MesurementPoint Square SMDPad 5mmx10mm ")
    (attr smd virtual)
    (fp_text reference J1 (at 4.13258 2.95148) (layer F.SilkS))
    (fp_text value EN (at 0 6.35) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at 0 0) (size 5 10) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(D1-Pad1)"))
  )
  (module Diode_SMD:D_SOD-123 (layer F.Cu) (tedit 58645DC7)
    (at 75.25512 115.7087 90)
    (descr SOD-123)
    (tags SOD-123)
    (attr smd)
    (fp_text reference D2 (at -0.26516 2.16916 90) (layer F.SilkS))
    (fp_text value 1N4148W (at 0 2.1 90) (layer F.Fab))
    (fp_text user %R (at 0 -2 90) (layer F.Fab))
    (pad 2 smd rect (at 1.65 0 90) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C5-Pad1)"))
    (pad 1 smd rect (at -1.65 0 90) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(D2-Pad1)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SMB (layer F.Cu) (tedit 58645DF3)
    (at 75.37196 126.2888 270)
    (descr "Diode SMB (DO-214AA)")
    (tags "Diode SMB (DO-214AA)")
    (attr smd)
    (fp_text reference D1 (at 0 -3 90) (layer F.SilkS))
    (fp_text value 3V3 (at 0 3.1 90) (layer F.Fab))
    (fp_text user %R (at 0 -3 90) (layer F.Fab))
    (pad 2 smd rect (at 2.15 0 270) (size 2.5 2.3) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -2.15 0 270) (size 2.5 2.3) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMB.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 94.95282 121.40692 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference COPT2 (at 3.3147 -1.74498 90) (layer F.SilkS))
    (fp_text value 0.47µ/100V (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 VPP))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 105.22712 121.43232 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference COPT1 (at -2.37998 -2.6797 90) (layer F.SilkS))
    (fp_text value 0.47µ/100V (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 VPP))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 77.1398 135.94588 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at 0 -1.65 90) (layer F.SilkS))
    (fp_text value 1µ/50V (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 7 BIAS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 78.54188 112.58042)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 0 -1.65) (layer F.SilkS))
    (fp_text value 1µ/50V (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(C5-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 88.22436 131.83362 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at -0.0127 1.74498 90) (layer F.SilkS))
    (fp_text value 2.2p/50V (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 FB))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:CP_Elec_8x10.5 (layer F.Cu) (tedit 5BCA39D0)
    (at 121.3231 133.98246 90)
    (descr "SMD capacitor, aluminum electrolytic, Vishay 0810, 8.0x10.5mm, http://www.vishay.com/docs/28395/150crz.pdf")
    (tags "capacitor electrolytic")
    (attr smd)
    (fp_text reference C3 (at 0 -5.3 90) (layer F.SilkS))
    (fp_text value 470µ/50V (at 0 5.3 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 3.7 0 90) (size 4.4 2.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1)
      (net 1 GND))
    (pad 1 smd roundrect (at -3.7 0 90) (size 4.4 2.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1)
      (net 2 VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/CP_Elec_8x10.5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text GND (at 122.56262 106.13644) (layer F.SilkS))
  (gr_text GND (at 132.97662 134.78002) (layer F.SilkS))
  (gr_text "65V 8A MAX" (at 99.95154 101.58476) (layer F.SilkS))
  (gr_text VIN (at 135.83666 127.91948) (layer F.SilkS))
  (gr_text VOUT (at 111.63808 145.40992) (layer F.SilkS))
  (gr_text TRIM (at 74.59726 106.04754) (layer F.SilkS))
  (gr_text EN (at 70.16242 121.59234) (layer F.SilkS))
  (gr_text PG (at 92.57538 105.74274) (layer F.SilkS))
  (gr_line (start 140 100) (end 65 100) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 140 150) (end 140 100) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 65 150) (end 140 150) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 65 100) (end 65 150) (layer Edge.Cuts) (width 0.1))
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 64.9986 99.99472) (xy 65.00876 149.9997) (xy 139.99972 149.99716) (xy 140.00226 100.00742)
      )
    )
  )
  (zone (net 15) (net_name "Net-(L2-Pad1)") (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 99.5553 123.0376) (xy 99.5553 124.27966) (xy 93.94698 129.88798) (xy 93.94698 135.24992) (xy 107.44454 135.24992)
        (xy 107.44454 129.3495) (xy 102.08514 123.9901) (xy 102.08514 123.0376)
      )
    )
  )
  (zone (net 2) (net_name VBUS) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 88.22436 136.92886) (xy 126.7079 136.92886) (xy 126.7079 146.5834) (xy 88.19134 146.5834) (xy 88.19134 136.92886)
      )
    )
  )
  (zone (net 9) (net_name VPP) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 99.0854 119.72036) (xy 99.0854 121.158) (xy 94.0562 121.158) (xy 94.0562 119.72036)
      )
    )
  )
  (zone (net 9) (net_name VPP) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 102.03942 119.71782) (xy 105.99928 119.71782) (xy 105.99928 121.15546) (xy 102.03688 121.15546)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.2))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 65.00114 100.00488) (xy 65.00368 149.99716) (xy 139.99972 149.9997) (xy 139.99718 100.00234)
      )
    )
  )
)
