(footprint "GCT_USB4500-03-0-A_REVA" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (property "MANUFACTURER" "GCT")
  (property "MAXIMUM_PACKAGE_HEIGHT" "2.46mm")
  (property "PARTREV" "A")
  (property "STANDARD" "Manufacturer Recommendations")
  (property "Sheetfile" "test3.kicad_sch")
  (property "Sheetname" "")
  (attr smd)
  (fp_text reference "J101" (at -2.375 -9.045) (layer "F.SilkS"))
  (fp_text value "USB4500-03-0-A_REVA" (at 9.155 -7.385) (layer "F.Fab"))
  (fp_text user "PCB Edge" (at 6.46 1.49) (layer "F.Fab"))
  (fp_line (start -6.52 1.6) (end -4.62 1.6)
    (layer "Edge.Cuts"))
  (fp_line (start -4.62 1.6) (end -4.62 -4.6)
    (layer "Edge.Cuts"))
  (fp_line (start -3.82 -4.6) (end 3.82 -4.6)
    (layer "Edge.Cuts"))
  (fp_line (start 4.62 -4.6) (end 4.62 1.6)
    (layer "Edge.Cuts"))
  (fp_line (start 4.62 1.6) (end 6.36 1.6)
    (layer "Edge.Cuts"))
  (fp_arc (start -4.62 -4.6) (mid -4.540343 -4.86731) (end -4.295 -5)
    (layer "Edge.Cuts"))
  (fp_arc (start -4.295 -5) (mid -4.07451 -4.92731) (end -3.97 -4.72)
    (layer "Edge.Cuts"))
  (fp_arc (start -3.82 -4.6) (mid -3.919853 -4.628934) (end -3.97 -4.72)
    (layer "Edge.Cuts"))
  (fp_arc (start 3.97 -4.72) (mid 3.919853 -4.628934) (end 3.82 -4.6)
    (layer "Edge.Cuts"))
  (fp_arc (start 3.97 -4.72) (mid 4.07451 -4.92731) (end 4.295 -5)
    (layer "Edge.Cuts"))
  (fp_arc (start 4.295 -5) (mid 4.540343 -4.86731) (end 4.62 -4.6)
    (layer "Edge.Cuts"))
  (pad "A1_B12" smd rect (at -3.2 -5.15) (size 0.6 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "A4_B9" smd rect (at -2.4 -5.15) (size 0.6 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "A5" smd rect (at -1.25 -5.15) (size 0.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "A6" smd rect (at -0.25 -5.15) (size 0.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "A7" smd rect (at 0.25 -5.15) (size 0.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "A8" smd rect (at 1.25 -5.15) (size 0.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "B1_A12" smd rect (at 3.2 -5.15) (size 0.6 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "B4_A9" smd rect (at 2.4 -5.15) (size 0.6 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "B5" smd rect (at 1.75 -5.15) (size 0.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "B6" smd rect (at 0.75 -5.15) (size 0.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "B7" smd rect (at -0.75 -5.15) (size 0.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "B8" smd rect (at -1.75 -5.15) (size 0.3 1.1) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "S1" thru_hole oval (at -5.62 0) (size 1.1 2.2) (drill oval 0.6 1.8) (layers "*.Cu"))
  (pad "S2" thru_hole oval (at 5.62 -4) (size 1.1 1.8) (drill oval 0.6 1.4) (layers "*.Cu"))
  (pad "S3" thru_hole oval (at -5.62 -4) (size 1.1 1.8) (drill oval 0.6 1.4) (layers "*.Cu"))
  (pad "S4" thru_hole oval (at 5.62 0) (size 1.1 2.2) (drill oval 0.6 1.8) (layers "*.Cu"))
)
