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PDF
st7036.pdf
SCL, r 20+0.1C b 300 20+0.1C b 300 SDA — ns SCL,SDA fall time f 20+0.1C b 300 20+0.1C b 300 Capacitive load represent byeach bus C — — 400 — 400 pf line b Setup time for a repeated START condition tSU;STA — 0.6 — 0.6 —
in „Initialisierungsfolge fuer EA DOGM 163 SPI 3.3V“ · Mikrocontroller und Digitale Elektronik ·
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PDF
st7036.pdf
SCL, r 20+0.1C b 300 20+0.1C b 300 SDA — ns SCL,SDA fall time f 20+0.1C b 300 20+0.1C b 300 Capacitive load represent byeach bus C — — 400 — 400 pf line b Setup time for a repeated START condition tSU;STA — 0.6 — 0.6 —
in „DOG-M Display über SPI“ · Mikrocontroller und Digitale Elektronik ·
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PDF
st7036.pdf
SCL, r 20+0.1C b 300 20+0.1C b 300 SDA — ns SCL,SDA fall time f 20+0.1C b 300 20+0.1C b 300 Capacitive load represent byeach bus C — — 400 — 400 pf line b Setup time for a repeated START condition tSU;STA — 0.6 — 0.6 —
in „LCD " ° " Zeichen aus Zeichensatz anzeigen?“ · Mikrocontroller und Digitale Elektronik ·
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PDF
st7036.pdf
SCL, r 20+0.1C b 300 20+0.1C b 300 SDA — ns SCL,SDA fall time f 20+0.1C b 300 20+0.1C b 300 Capacitive load represent byeach bus C — — 400 — 400 pf line b Setup time for a repeated START condition tSU;STA — 0.6 — 0.6 —
in „Controller ST7036“ · Mikrocontroller und Digitale Elektronik ·
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PDF
00643b.pdf
,W sample = ADPCMDecoder( (code>>4)&0x0f ); 0288 00A7 MOVWF 27 0289 0EA7 SWAPF 27 028A 300F MOVLW 0Fh 028B 0527 ANDWF 27,W 028C 390F ANDLW 0Fh 1997 Microchip Technology Inc. DS00643B-page 27 AN643 028D 21A5 CALL 01A5h 028E 1283 BCF STATUS,RP0 028F 00BC MOVWF 3C 0290 0804 MOVF FSR,W 0291 00BD
in „Messdaten Kompression“ · Digitale Signalverarbeitung / DSP / Machine Learning ·
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ST7036-V1.7.pdf
SCL, r 20+0.1C b 300 20+0.1C b 300 SDA — ns SCL,SDA fall time f 20+0.1C b 300 20+0.1C b 300 Capacitive load represent byeach bus C — — 400 — 400 pf line b Setup time for a repeated START condition tSU;STA — 0.6 — 0.6 —
in „Newbie Probleme bei LCD DOGM Initialisierung in Assembler“ · Mikrocontroller und Digitale Elektronik ·
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PDF
st7036.pdf
SCL, r 20+0.1C b 300 20+0.1C b 300 SDA — ns SCL,SDA fall time f 20+0.1C b 300 20+0.1C b 300 Capacitive load represent byeach bus C — — 400 — 400 pf line b Setup time for a repeated START condition tSU;STA — 0.6 — 0.6 —
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PDF
st7036.pdf
SCL, r 20+0.1C b 300 20+0.1C b 300 SDA — ns SCL,SDA fall time f 20+0.1C b 300 20+0.1C b 300 Capacitive load represent byeach bus C — — 400 — 400 pf line b Setup time for a repeated START condition tSU;STA — 0.6 — 0.6 —
in „STK500 und LCD (ST7036) Problem“ · Mikrocontroller und Digitale Elektronik ·
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PDF
ST7036.pdf
SCL, r 20+0.1C b 300 20+0.1C b 300 SDA — ns SCL,SDA fall time f 20+0.1C b 300 20+0.1C b 300 Capacitive load represent byeach bus C — — 400 — 400 pf line b Setup time for a repeated START condition tSU;STA — 0.6 — 0.6 —
in „i2C TWI Modus - ST7036 - DOGM DOGM162 DOGM081 EA DOGM163, ist das Möglich ?“ · Mikrocontroller und Digitale Elektronik ·
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PDF
Philips-Technical-Application-Guide-Fluorescent.pdf
ignited,the voltage at point P changes This is done by applying a frequency different from the to 300V,which is divided into 100V for the lamp and operating frequency (normally higher) to the LC starting 200V for the transformer coil L1.As transformer coil L2 circuit for about 1.4 second to ensure a
in „EVG 5m von Leuchtstofflampe entfernt“ · Analoge Elektronik und Schaltungstechnik ·
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PDF
PS-MPU-6000A-00v3.4.pdf
Auxiliary I C I/O (AUX_CL, AUX_DA) MPU-6050: AUX_VDDIO=0 V , LOW-Level Input Voltage -0.5V to 0.3*VLOGIC V IL V IHHIGH-Level Input Voltage 0.7*VLOGIC to V VLOGIC + 0.5V V hysysteresis 0.1*VLOGIC V V OL1 LOW-Level Output Voltage VLOGIC > 2V; 1mA sink current 0 to 0.4 V V OL3 LOW-Level Output Voltage VLOGIC <
in „Neigungswinkelinkelmessung beweglicher Teile“ · Analoge Elektronik und Schaltungstechnik ·
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PDF
M37560_Prozessor.pdf
SEG 0–SEG 17 –0.3 to VL3 V V O Output voltage XOUT –0.3 to CC +0.3 V Pd Power dissipation Ta = 25°C 300 mW Operating temperature Topr –20 to 85 °C Tstg Storage temperature –40 to 125 °C RECOMMENDED OPERATING CONDITIONS Table 16 Recommended operating conditions (1) (V CC = 2.2 to 5.5 V, Ta = –20 to 85°
in „M37560 (Buderus-Steuerung) puffern“ · Mikrocontroller und Digitale Elektronik ·
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PDF
MFRC522.pdf
and NRSTPD ILI input leakage current 1 - +1 A V IH HIGH-level input voltage 0.7V DD(PVDD) - - V V IL LOW-level input voltage - - 0.3VDD(PVDD) V Pin MFIN ILI input leakage current 1 - +1 A V IH HIGH-level input voltage 0.7V DD(SVDD) - - V V IL LOW-level input voltage - - 0.3VDD(SVDD) V Pin SDA ILI
in „Schlüsselcodes in EEPROM identifizieren“ · Fahrzeugelektronik ·
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PDF
Datasheet_MFRC522.pdf
and NRSTPD ILI input leakage current 1 - +1 A V IH HIGH-level input voltage 0.7V DD(PVDD) - - V V IL LOW-level input voltage - - 0.3VDD(PVDD) V Pin MFIN ILI input leakage current 1 - +1 A V IH HIGH-level input voltage 0.7V DD(SVDD) - - V V IL LOW-level input voltage - - 0.3VDD(SVDD) V Pin SDA ILI
in „IRQ am RFID RC522“ · Mikrocontroller und Digitale Elektronik ·
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PDF
go-SSD1325.pdf
matrix display: o OLED driving output voltage, 14V maximum o Can output maximum segment source current: 300uA o Common maximum sink current: 40mA Embedded 128 x 80 x 4 bit SRAM display memory 128 step contrast current control on monochrome passive OLED panel 16 gray scale Internal Oscillator Programmable
in „Wie Dc/Dc-Wanlder aktivieren? (Display)“ · Mikrocontroller und Digitale Elektronik ·
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PDF
go-SSD1325.pdf
matrix display: o OLED driving output voltage, 14V maximum o Can output maximum segment source current: 300uA o Common maximum sink current: 40mA Embedded 128 x 80 x 4 bit SRAM display memory 128 step contrast current control on monochrome passive OLED panel 16 gray scale Internal Oscillator Programmable
in „Densitron OLED“ · Mikrocontroller und Digitale Elektronik ·
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PDF
SSD1307.pdf
DIE PAD FLOOR PLAN Figure 5-1 : SSD1307Z Die Drawing Die Size 6.44mm x 0.81mm Pin 1 Die Thickness 300 um ± 25 um Min I/O pad pitch 60 um Min SEG pad pitch 32.4 um Min COM pad pitch 40 um Bump Height Nominal 15 um Bump Size Pad # X [um] Y [um] 1~57 40 110 240~244 110 40 58~62 110 30 63~65, 237~238 50
in „STM32 F103 - I2C Probleme“ · Mikrocontroller und Digitale Elektronik ·
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PDF
GD32VF103_Datasheet_Rev1.0.pdf
Table 4-21. NRST pin characteristics Symbol Parameter Conditions Min Typ Max Unit (1) V IL(NRST) NRST Input low level voltage -0.5 — 0.3 VDD (1) 2.6 V ≤ VDD= VDDA V V IH(NRST) NRST Input high level voltage 0.7 VDD — VDD+ 0.5 (1) ≤ 3.6 V Vhyst Schmidt trigger Voltage hysteresis — 260 — mV R
in „RISC-V: Wird das was?“ · Mikrocontroller und Digitale Elektronik ·
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PDF
GD32VF103_Datasheet_Rev1.0.pdf
Table 4-21. NRST pin characteristics Symbol Parameter Conditions Min Typ Max Unit (1) V IL(NRST) NRST Input low level voltage -0.5 — 0.3 VDD (1) 2.6 V ≤ VDD= VDDA V V IH(NRST) NRST Input high level voltage 0.7 VDD — VDD+ 0.5 (1) ≤ 3.6 V Vhyst Schmidt trigger Voltage hysteresis — 260 — mV R
in „STM32F103C8T6 => GD32VF103C8T6“ · Mikrocontroller und Digitale Elektronik ·
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PDF
drv8350f_7_.pdf
DVDD 18 k ▯± 5% – VI6 to DVDD 450/900 mA 0.7 V 75 k ▯± 5% 73 k + VI5 to DVDD – Hi-Z (>500 k ▯ VI4 300/600 mA 0.4 V to AGND) 73 k + VI3 75 k ▯± 5% to AGND – V 18 N ▯ 5% 150/300 mA 0.2 V I2 to AGND + VI1 Tied to AGND – 100/200 mA 0.1 V + – 50/100 mA 0.06 V Figure 8-22. Seven Level Input Pin Structure
in „BLDC-Motor: Überspannung beim Bremsen trotz Durchschaltung aller Low-Side-MOSFETs?“ · Analoge Elektronik und Schaltungstechnik ·
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PDF
CD00277537.pdf
250 - 100 - (3) th(SDA) SDA data hold time 0 - 0 900 tr(SDA) SDA and SCL rise time - 1000 20 + 0.1C 300 ns tr(SCL) b tf(SDA) tf(SCL) SDA and SCL fall time - 300 - 300 th(STA) Start condition hold time 4.0 - 0.6 - Repeated Start condition µs su(STA) setup time 4.7 - 0.6 - tsu(STO) Stop condition setup
in „SPI-Schnittstelle Befehl: SPI_I2S_SendData(spi2, data)“ · Mikrocontroller und Digitale Elektronik ·
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PDF
vacon-x2c-series-user-s-manual.pdf
20 °C to +60 °C Humidity 90% RH or less, non-condensing Vibration 0.6 G maximum Elevation 1000 m (3,300 ft.) without derating 1.0-400 Hz programmable in 0.05 Hz increments Frequency range (0.1 Hz above 99.95 Hz) Control system Voltage vector pulse width modulation (PWM) Frequency command selections 0-
in „TWIKE - Gedanken zu einem anderen Antriebssystem“ · Offtopic ·
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PDF
PDF-Demo_Board.pdf
Microchip Technology Inc. DS51275A-page 17 PICDEM™ 2 Plus User’s Guide +5V R20 10K R5 R6 02 R21 470 10K 300 RB0 LCD1 4 03 R22 470 DB0 RB1 RA1 3 E DB1 5 RA2 2 R/W DB2 6 1 7 04 R23 470 RB2 RA3 14 RS DB3 8 VEE DB4 RO0 +5V 13 VCC DB5 9 RO1 12 GND DB6 10 RO2 05 R24 470 RB3 15 GND1 11 DB7 RO3 J6 +5V +5V C11 C12
in „PIC steuert LED sehr seltsam“ · Mikrocontroller und Digitale Elektronik ·
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PDF
Display_-_NL10276BC30-04D.pdf
voltage Differential input voltage VI 0 – 2.4 V – Terminating resistor RT – 100 – – Supply current IC – 300 Note 2 600 mA VCC= 5.0 V Notes: 1. Common mode voltage; LVDS driver 2. Checker flag pattern (in EIAJ ED-2522) (2) Backlight T a= 25°C Parameters Symbols Min. Typ. Max. Unit Remarks Lamp current IL 3.0
in „VIA Nano Board LVDS Connector“ · Mikrocontroller und Digitale Elektronik ·
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PDF
Display_-_NL10276BC30-04D.pdf
voltage Differential input voltage VI 0 – 2.4 V – Terminating resistor RT – 100 – – Supply current IC – 300 Note 2 600 mA VCC= 5.0 V Notes: 1. Common mode voltage; LVDS driver 2. Checker flag pattern (in EIAJ ED-2522) (2) Backlight T a= 25°C Parameters Symbols Min. Typ. Max. Unit Remarks Lamp current IL 3.0
in „günstiges ITX Mainboard mit LVDS Connector“ · Mikrocontroller und Digitale Elektronik ·
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PDF
LQ043T1DG01_SP_072106.pdf
Permissive input ripple voltage VRFAVDD - - 100 mVp-p AVDD=+5.0V Input voltage (Low) V - - 0.2 V V IL CC 【 Note 4】 Input voltage (High) V 0.8V CC - - V IH Input current (Low) I - - 4.0 µA V I0V OL 【 Note 4】 V =2.5V Input current (High) I - - 4.0 µA I OH 【 Note 4】 ※ The rush current will flows when power
in „Ansteuerung LQ043T1DG01“ · Mikrocontroller und Digitale Elektronik ·
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PDF
0710.pdf
Output Voltage VFAULT 1 mA sink current at FAULT pin – – 0.4 V Fault Enable (FAULT_EN Pin) Input Low V IL – – 0.1×VCC V Voltage Threshold Continued on the next page… Allegro MicroSystems, Inc. 4 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 120 kHz Bandwidth
in „Stromsensor ACS710“ · Analoge Elektronik und Schaltungstechnik ·
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PDF
Designing_a_digital_compass.pdf
resolution MPLAB C18 C Compiler, MPLAB ICD 2 (available compass. from Microchip) Heading Refresh Rate: ≈300 ms The HMC1051/1052 sensors are made up of permalloy (NIFE) thin films that create changes in resistivity with 12-Bit A/D Results respect to external magnetic fields. These films can be Earlier, we
in „Kompassmodul HDMM01 von Pollin“ · Mikrocontroller und Digitale Elektronik ·
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PDF
MAX639-MAX653.pdf
Continuous Power Dissipation AT= +70°C) Lead Temperature (soldering, 10s).................................+300°C Plastic DIP (derate 9.09mW/°C above +70°C) .............727mW / SO (derate 5.88mW/°C above +70°C)..........................471mW CERDIP (derate 8.00mW/°C above +70°C)..................640mW 0 Note
in „Spannung am Ausgang eines Converters anlegen“ · Mikrocontroller und Digitale Elektronik ·
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PDF
LQ121S1LG75.pdf
100 mV V CM =+1.2V Threshold voltagLow VTL V CM-100 － － mV 【*3】 V 2.1 － － V 【*4】 Input voltage IH V IL － － 0.8 V IOH － － 400 μ A V I23.3V 【*4】 Input reak current I -10 － +10 μ A V =0V 【*4】 OL I2 Terminal resistor R T － 100 － Ω Differential input 【*1】 On-off conditions for supply voltage 0.9 CC 0.9 CC
in „Mini2440 LVDS Display Adapter für größere TFTs“ · Projekte & Code ·
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ml280epson_tcm3-37706.pdf
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 0 20 40 60 100 120 140 160 200 220 240 260 300 320 340 360 1 17 33 49 65 81 97 113 129 145 161 177 193 209 225 241 1 1 21 41 61 101 121 141 161 201 221 241 261 301 321 341 361 2 18 34 50 66 82 98 114 130 146 162 178 194 210 226 242 2 2 22 42 62
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40146F.pdf
LED • Current limiting on LEDoutput LED driver • Minimum component count Enhanced Features Over HCS300 EEPROM • 48-bit seed vs. 32-bit seed Encoder • 2-bit CRC for error detection DATA • 28/32-bit serial number select 32-bit shift register • Two seed transmission methods • PWM and VPWM modulation VSS
in „Fehlersuche Funksender Zentralverriegelung Toyota Yaris“ · Fahrzeugelektronik ·
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PDF
ca3140-a.pdf
. . . . . . . . . -65 C to 150 C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300 C Operating Conditions (SOIC - Lead Tips Only) o o Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C *Pb-free PDIPs can be used for through hole wave solder process-
in „OpAmp Ausgang schwingt mit 50Hz (oder 100)“ · Analoge Elektronik und Schaltungstechnik ·
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PDF
Datenblatt_Pegelwandler_TXS0108E.pdf
to 5.5 0.4 OL IB Port A output IOL= 220 μA, VIB 0.15 V 1.65 1.65 to 5.5 0.4 VOLA V low voltage IOL= 300 μA, VIB 0.15 V 2.3 1.65 to 5.5 0.4 IOL= 400 μA, VIB 0.15 V 3 1.65 to 5.5 0.55 VOHB Port B output IOH = –20 μA, 1.4 1.65 to 5.5 V CCB × 0.67 V high voltage V IAV CCA – 0.2 V I = 220 μA, V ≤ 0.15 V 1.4 to 3.6 1.65 0.4 OL IA IOL= 300 μA, VIA 0.15 V 1.4 to 3.6 2.3 0.4 VOLB Port B output V low voltage IOL= 400 μA, VIA 0.15 V 1.4 to 3.6 3 0.55 IOL= 620 μA, VIA 0.15 V 1.4 to 3.6 4.5 0.55 I Input leakage OE: 1.4 1.65 to 5.5 –1 1 2 μA
in „Wozu Pull-Down Widerstand?“ · Mikrocontroller und Digitale Elektronik ·
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PDF
ttester.pdf
weitergeladen. Bei Annäherung der Spannung an die 300mV wird wie- der mit den kürzeren Ladepulsen weitergeladen. Die gesamte Ladezeit wird dabei zusammengezählt und nach Überschreitung der 300mV die Kapazität aus der geladenen Spannung und der Ladezeit
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PDF
ttester.pdf
weitergeladen. Bei Annäherung der Spannung an die 300mV wird wie- der mit den kürzeren Ladepulsen weitergeladen. Die gesamte Ladezeit wird dabei zusammengezählt und nach Überschreitung der 300mV die Kapazität aus der geladenen Spannung und der Ladezeit
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PDF
ttester.pdf
weitergeladen. Bei Annäherung der Spannung an die 300mV wird wie- der mit den kürzeren Ladepulsen weitergeladen. Die gesamte Ladezeit wird dabei zusammengezählt und nach Überschreitung der 300mV die Kapazität aus der geladenen Spannung und der Ladezeit
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PDF
ATTiny15L.pdf
Characteristics TA= -40°C to 85°C, V CC = 2.7V to 5.5V Symbol Parameter Condition Min Typ Max Units (1) V IL Input Low Voltage Except (XTAL) -0.5 0.3 VCC V (1) V IL1 Input Low Voltage XTAL -0.5 0.1 VCC V (2) V IH Input High Voltage Except (XTAL, RESET) 0.6 VCC VCC + 0.5 V (2) V IH1 Input High Voltage XTAL 0.7
in „ATtiny 15 Datenblatt nicht auffindbar??“ · Mikrocontroller und Digitale Elektronik ·
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PDF
amd_functional_datasheet.pdf
Reference voltage (for I/O), V 0.49*VDDIO_dc 0.5*VDDIO_dc 0.51*VDDIO_dc 1, 12 MEMVREF pin Min Max Il Input leakage current mA -1 1 Any input: 0 < IN< VDDIO V (All other pins not under test = 0V) Ioz Output leakage current mA -1 1 Any output: 0 < OUT < V DDIOV V IH Input high voltage (logic 1) V Vref 0.15 - - 2 V IL Input low voltage (logic 0) V - - V ref 0.15 2 Output high voltage (logic 1) V 2.0 (for VID[4:0]) V OH Output high voltage (logic 1) V 1.8 (for all other pins) V OL Output low voltage (logic 0) V 0.65
in „Am3 Mainboard Vcore instabil wenn kalt“ · PC Hard- und Software ·
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PDF
SSD1351-Revision_1.5.pdf
•Min SEG pad pitch: 25um SSD1351Z 128RGB 128 COG 9 , 56 •Min COM pad pitch: 35um •Die thickness : 300 +/- 15um •48mm film, 4 sprocket hole •Hot bar type COF SSD1351UR1 128RGB 128 COF 12 , 55 •8/16/18-bit 80/68/SPI interface •SEG lead pitch: 0.050x0.999=0.04995mm •COM lead pitch: 0.06x0.999=0.05994mm
in „OLED128x128 SSD1351 RGB Initialisierung Color Farbe bunt SPI 3.3V AVR ATmega8 ATmega328p Assembler“ · Projekte & Code ·
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PDF
AoE3_chapter9.pdf
impossible! 342 5.6 Component errors 299 5.12.2 Wrong – it is possible! 342 5.6.1 Gain-setting resistors 300 5.12.3 Block diagram: a simple plan 343 5.6.2 The holding capacitor 300 5.12.4 The 34401A 6.5-digit front end 343 5.6.3 Nulling switch 300 5.12.5 The 34420A 7.5-digit frontend 344 5.7 Amplifier input
in „Labornetzgerät - Fragen zum Schaltplan“ · Analoge Elektronik und Schaltungstechnik ·
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PDF
W25Q256JW_SPI_RevJ_03102021_Plus.pdf
......................................................................6 3.3 Pin Configuration SOIC 300-mil ...........................................................................................7 3.4 Pin Description SOIC 300-mil.....................................................................
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SSD1305.pdf
COM lead pitch 0.120mm x 0.998 =0.11976mm SSD1305Z3 132 64 Gold Bump Die Page 69 • Die Thickness : 300 um ± 25 um SSD1305 Rev 1.9 P 7/70 May 2008 Solomon Systech 4 BLOCK DIAGRAM Figure 4-1 : SSD1305 Block Diagram Solomon Systech May 2008 P 8/70 Rev 1.9 SSD1305 5 DIE PAD FLOOR PLAN Figure 5-1 : SSD1305Z
in „i2c lese problem“ · Mikrocontroller und Digitale Elektronik ·
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PDF
DSASW00146882.pdf
COM lead pitch 0.120mm x 0.998 =0.11976mm SSD1305Z3 132 64 Gold Bump Die Page 69 • Die Thickness : 300 um ± 25 um SSD1305 Rev 1.9 P 7/70 May 2008 Solomon Systech 4 BLOCK DIAGRAM Figure 4-1 : SSD1305 Block Diagram Solomon Systech May 2008 P 8/70 Rev 1.9 SSD1305 5 DIE PAD FLOOR PLAN Figure 5-1 : SSD1305Z
in „OLED Display mit ssd1305 Chip“ · Mikrocontroller und Digitale Elektronik ·
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PDF
MXB7846.pdf
................................................2kV (500V)g, 10s).................................+300°C M Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other
in „OLED Sammelbestellung“ · Markt ·
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PDF
tlv571.pdf
current VAIN = 0 to DD 〉 1 A Voltage reference input ri Input resistance 2 k Ci Input capacitance 300 pF Power supply AVDD = DVDD = 3 V,CLK = 10 MHz 4 5.5 mA Operating supply curreDD,+ REF AVDD = DVDD = 5 V,CLK = 20 MHz 7 8.5 mA AV +DV = 3 V 12 17 mW PD Power dissipation DD DD AVDD +DV DD = 5 V 35 43
in „EEPROM beschreiben ohne MC“ · Mikrocontroller und Digitale Elektronik ·
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PDF
Agilent_ADNS-2051_-_153206449.pdf
Typical LED Current Table R1 Value k 15 18 22 27 33 37 – 80 LED current (typical) mA 42 35 29 23 19 17 IL60 I M 40 N 20 R = 30 k 00 0.5 1.0 1.5w2.0 2.5 3.0 3.5 VOL(V) Figure 11. Typical I-V characteristic of ADNS-2051 XY_LED pin. 10 PD Pin Timing PD IDD 75 FRAMES pd 705 µs t t(SEE FIGURE 15) m Figure 12.
in „USB Maus mit USART auslesen“ · Mikrocontroller und Digitale Elektronik ·
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PDF
TCS3414_Datasheet_EN_v1.pdf
μs t(TIMEOUT) Clock/data fall timew timeout (SMBus only)s e 25 3005 ns tR Clock/data rise time m t 300 ns Ci Input pin capacitance a n 10 pF tLOW (SYNC) SYNC low period (see Figure 1) o 50 μs tF (SYNC)NC) SYNC fall time (see Figure 1)1) c 50 ns tR (SYNC) SYNC rise time (see Figure 1) 50 ns † Specified
in „Messgerät um LED Eigenschaften zu ermitteln“ · Analoge Elektronik und Schaltungstechnik ·
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PDF
UCC27201_datasheet.pdf
dissipation atAT = 25°C (DDA package) (4) 2.7 W (4) (DRM package) 3.3 Lead temperature (soldering, 10 s) 300 °C Operating virtual junction temperatuJe, T –40 150 °C Storage temperature, stg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
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PDF
STM8S105.pdf
Data retention (data memory) after RET = 85° C 1.0 300 k erase/write cyclesatAT = +125 °C IDD Supply current (Flash 2.0 mA programming or erasing for 1 to 128 bytes) (1) Data based on characterization results, not tested in production. (2) The physical
in „Handbuch STM8S Discovery“ · Mikrocontroller und Digitale Elektronik ·