Gast
#3488648
Niergends im Datenblatt auch nur ein wort zu dem exposed pad unter dem QFN44-8x8 Gehäuse. PIC32MX250F128D-I_ML Was wird damit gemacht? mit GND verbinden?
Gast
#3488688
hab was gefunden: Below is a response from Microchip Engineering Support Team for your submitted ticket #: 1-142690. Problem Resolution: The exposed pads in QFN (any) packages parts increase the maximum power dissipation of the packages. When an exposed pad is offered as an option, it is specifically to increase the power dissipation capabilities of the IC package. In most applications, the exposed pad is connected to ground. Hence the center pad can be connected electrically to ground without any harm in the PCB. As far the potential of the pad is concerned, it is not connected anywhere hence no potential.
Simon schrieb: > Niergends im Datenblatt auch nur ein wort zu dem exposed pad unter dem > QFN44-8x8 Gehäuse. > > PIC32MX250F128D-I_ML > > Was wird damit gemacht? mit GND verbinden? Lies doch einfach mal das RICHTIGE Datenblatt ;-) PIC32MX1XX/2XX Family Data Sheet, Seite 9, Fußnote 3: "The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally" Und bevor Du fragst: http://ww1.microchip.com/downloads/en/DeviceDoc/61168E.pdf Gruss Andreas
Gast
#3488826
genau das Datenblatt hab ich hier, ooooh man, na gut Danke!