Jake Bugg - live @ Main Square Festival 2016.mp4 https://www.youtube.com/watch?v=ZzoOn1IYjiE Eins der wenigen HD-Videos und kein hochskalierter 480-er Pixelbrei.
https://www.dubspencer.com/index.php?page=news https://open.spotify.com/intl-de/artist/0VU96E512M8L7rxEdTNHq2 https://www.youtube.com/@dubspencertrancehill Coole Dub and Trance Cover von The Clash über Deep Purple bis Mettalica
solder reflow profile for both package options is shown in Figure 10. t p ) CTp s Critical Zone: when e T is in the range r Ramp Up T to T g L p e (TL tL , e TSMax u t Ramp r Down e p m T TSMin tS Preheat 25 T = 25º C to T P Time, t (seconds) Figure 10 - FT232R Solder Reflow Profile The recommended values
TEMPERATURE ? ? MASTER DISABLES MASTER DISABLES Y STRONG PULLUP Y STRONG PULLUP MASTER MASTER MASTER MASTER RX“0s” RX“1s” RX“0s” RX“1s” B4h BEh 4Eh N READ N B8h N N POWER SUPPLY RECALL E2 READ WRITE ? SCRATCHPAD SCRATCHPAD ? ? ? Y Y Y Y MASTER TXTHBYTE TO SCRATCHPAD N Y MASTER R XATA BYTE PARASITE FROM SCRATCHPAD POWERED MASTER BEGIN2 DATA ? RECALL FROM E PROM MASTER T X LYTE TO SCRATCHPAD MASTER MASTER MASTER Y RX“1s” RX “0s” TXRESET ? DEVICE BUSY RECALLING N N DATA ? N Y HAVE 8 BYTES BEEN READ ? MASTER MASTER Y R “0s” R “1s” X X MASTER R XCRATCHPAD
THEN Z=3 38 N=(M+Z)&3:RETURN 39 'check if figure f can move 40 L=0:R=0:U=0:D=0:A=F*5 41 N=AR(A+2):E=100+AR(A)*21+AR(A+1) 42 IF AR(E-21)<>49 THEN U=1 43 IF AR(E+21)<>49 THEN D=1 44 IF AR(E-1)<>49 THEN L=1 45 IF AR(E+1)<>49 THEN R=1 46 RETURN 47 'draw figures 48 FOR W=1 TO 4:A=W*5 49 J=AR(A+3
I 52 IF (G>0)&(G<>7) THEN COL 7,0 53 ? @1+J,4+I;%25;:NEXT 54 J=AR(3):I=AR(4):GOS 91:COL 6,0 55 E=100+21*AR(0)+AR(1) 56 IF AR(E)=42 THEN GOSUB 61 57 IF AR(E)=46 THEN GOSUB 60 58 DA E,0:? @1+AR(0),4+AR(1);%26; 59 DA 3,AR(0),AR(1):RET 60 NO 104: P=P+1:Q=Q-1:RET 61 NO 120: P=P+10:G=50:RET 62
MASTER DISABLES MASTER DISABLES STRONG PULLUP Y STRONG PULLUP MASTER MASTER MASTER MASTER R X0s” R X1s” RX“0s” RX“1s” B4h BEh 4Eh N READ N B8h N N POWER SUPPLY RECALL E2 READ WRITE ? SCRATCHPAD SCRATCHPAD ? ? ? Y Y Y Y MASTER TXTHBYTE TO SCRATCHPAD N Y MASTER R XATA BYTE PARASITE FROM SCRATCHPAD POWERED MASTER BEGIN2 DATA ? RECALL FROM E PROM MASTER T X LYTE TO SCRATCHPAD MASTER MASTER MASTER Y RX“1s” RX“0s” TXRESET ? MASTER TXCONFIG. BYTE DEVICE TO SCRATCHPAD BUSY RECALLING N N DATA ? N Y HAVE 8 BYTES BEEN READ ? MASTER MASTER Y R “
Connections for four standard LCDs ....................... 27 3.4.1 Connections to Sharp LM64183P (640 x 480 DSTN MONO LCD) ..............................27 3.4.2 Connections to PLANAR EL (640 x 480 AD4 EL)..................................................28 3.4.3ConnectionstoToshibaLTM10C042 (640 x 480 TFT
gesetzl. MWSt. - Buchpreise (*) inkl. 7% MWSt. 31 LVCS12 LOW-VOLTAGE HCS12 CONTROLLER MODUL MIT MC9S12E128 Mit dem 16-Bit Controller MC9S12E128 kommt auf dem LVCS12 ein Low-Voltage HCS12 Typ zum Einsatz, welcher nicht nur mit 5V, sondern auch mit 3,3V Betriebsspan- nung versorgt werden kann. Diese MCU
General Electrical Specification Parameter Description Min. Typ. Max. Unit Carrier Frequency 2.402 2.480 GHz RF Output Power Measured in 50ohm 15 16.5 18 dBm RX sensitivity - -88 -86 dBm Load Impedance No abnormal Oscillation 5:1 Input Low Voltage RESET,UART,GPIO,PCM -0.30 - 0.80 DCV Input High Voltage
, für diese Zwecke den Originalträger auszublenden (evtl. draufPLLen und mit inv. Polarität in den RX einspeisen ?) Leider kann ich nicht wirklich mehr reininterpretieren ausser die Geschwindigkeit, mit der sich der Weg der am Flugzeug reflektierten Welle ändert. Empfang mehrerer Kanäle (Sender mit
der Reflexionen daran, dass der VOR Sender auf Bodenhöhe steht (Gib mal 52 33' 41.4"N,13 17' 15.2"E in GoogleMaps ein), und erheblich höherer Dämpfung durch Gebäude (5km Innenstadt) unterworfen ist, als die Flugzeuge in der Luft. Wundern würde es mich nur, wenn ich wie oben angesprochen tatsächlich
General Electrical Specification Parameter Description Min. Typ. Max. Unit Carrier Frequency 2.402 2.480 GHz RF Output Power Measured in 50ohm 15 16.5 18 dBm RX sensitivity - -88 -86 dBm Load Impedance No abnormal Oscillation 5:1 Input Low Voltage RESET,UART,GPIO,PCM -0.30 - 0.80 DCV Input High Voltage
Initialisierung des UART liegt. Ich benutze diesen UART eben auch noch als SPI Schnittstelle. interrupt (UART0RX_VECTOR) usart0_rx(void) { nmeabuffer[i] = RXBUF0; i += 1; } void init_spi(void) { U0CTL |= SWRST; P3SEL = 0x0E; // Port 3 fur SPI verwenden
UCTL1 &= ~SWRST; // USART freigeben IE2 |= URXIE1; // TX- und RX-interrupts anschalten } Hier dann die Interrupt Routine interrupt (UART1RX_VECTOR) usart1_rx(void) { nmeabuffer[i] = RXBUF1; i += 1; }
---------------------- Found 1-bit register for signal <TX_BUSY>. Found 1-bit register for signal <RX_BUSY>. Found 1-bit register for signal <RS232_TXD>. Found 8-bit register for signal <DATA_RX>. Found 1-bit register for signal <RX_DATA_RCVD>. Found 8-bit register for signal <BYTE_RX>. Found 11-bit
N NONVOLATILE Y N DEVICE BUSY Y MEMORY CONVERTING BUSY TEMPERATURE ? ? MASTER MASTER MASTER MASTER RX“1”s RX“0”s RX “1”s RX“0”s 030598 14/27 DS1820 MEMORY FUNCTIONS FLOW CHART Figure 10 (cont’d) B8h B4h RECALL N READ N E2 POWER SUPPLY ? ? Y Y DS1820 2ECALLS FROM E PROM MASTER Y MASTER Y TX RESET TXRESET
N NONVOLATILE Y N DEVICE BUSY Y MEMORY CONVERTING BUSY TEMPERATURE ? ? MASTER MASTER MASTER MASTER RX“1”s RX“0”s RX “1”s RX“0”s 030598 14/27 DS1820 MEMORY FUNCTIONS FLOW CHART Figure 10 (cont’d) B8h B4h RECALL N READ N E2 POWER SUPPLY ? ? Y Y DS1820 2ECALLS FROM E PROM MASTER Y MASTER Y TX RESET TXRESET
solder reflow profile for both package options is shown in Figure 10. t p ) CTp s Critical Zone: when e T is in the range r Ramp Up T to T g L p e (TL tL , e TSMax u t Ramp r Down e p m T TSMin tS Preheat 25 T = 25º C to T P Time, t (seconds) Figure 10 - FT232R Solder Reflow Profile The recommended values
constant, but has the same temperature information as V CDwhich linearises the sensor characteristic. E E E A A A RREF B RREF RREF UTI B B UTI UTI C C C RX D RX D RX D F F F a) b) c) Figure 10. Connection of the thermistor to the UTI in a 4-wire (a), 3-wire (b) and 2-wire (c) connection Parameter (V =
BufferSize must fit perfectly into BootStart!"? Beim ATmega8 z.B. ist BufferSize = 15*PageSize = 15*32 = 480 = 0x1E0 (warum dieser Wert?). Beim ATmega168: BufferSize = 4*PageSize = 4*64 = 256 = 0x100 Ich Frage, da ich den Bootloader mit einem ATmega88 verwende, der eine PageSize von 32 hat. Ergo müsste ich
******************************************************************** 2;* U S B S T A C K F O R T H E A V R F A M I L Y 3;* 4 5;* File Name :"USB90S2313.asm" ;* Title :USB stack + Infrared remote control to nonUSB MCU 6;* Date :5.4.2003 7;* Version :1.6 8;* Target MCU :AT90S2313-10,AT90S2323-10,AT90S2343
, LED_RX aus. Rest an. direkt nach senden von einem String vom PC zum Boart über UART: LED_RETRANS, LED_ERR geht aus. LED_RX glimmt nach dem Senden aller Buchstaben von "test": LED_POWER, LED_RX
check for received data */ if (rf12_data()) { // Daten im RF12 RX Puffer ? rx_cnt=rf12_rxdata(rxbuf, &status, &rx_id); // komplettes Paket empfangen if (rx_cnt<=MAX_BUF) { // Daten gültig (d.h. kein CRC Fehler) ?
degree 000-180 [3] “21”: Minute (integer) 00-59 [2] “”: Minute (fraction) 0-9999 [variable] See NOTE “E”: East/West E or W [1] NOTE: Digits below 1/10000 are ignored. 5-7. Null Fields Any entry is ignored. 8. Checksum [2] Interpreting Example 34 deg 44.1230 min N 135 deg 21.0000 min E - 9 - Specifications
--- --- 0100 +18 dB --- --- 1010* +0 dB 1011 -3 dB --- --- 1101 -9 dB 1110 -12 dB 1111 mute 7 RSD Rx Suppression Disable 0* enable Rx suppression 1 disable Rx suppression 6-5 NCC NEC Coefficient Control 00* Normal 01 Clear 10 Freeze 11 reserved 4 AuNECD Auto re-engage NEC Disable 0* enable Auto NEC
bus is in the inactive (high) state during the recovery period. If the bus is held low for more than 480 ms, the DS1821 will be reset. HARDWARE CONFIGURATION Figure 6 Micro- processor V DD DS1821 1-WIRE PORT 4.7K DQ Pin R RX 1-wire bus X 5 µA Typ. TX TX 100 W M OSFET RX= RECEIVE T = TRANSMIT X TRANSACTION
Evaluation board is shown below followed by a brief description of each sub-section. LVDS Interface LVDS RX t t 10-bit data, frame, clock e EXP Slot e n n o o C C LVDS TX 10-bit data, frame, clock Configuration and Debug Ports System ACE Module Connector Platform Flash Miscellaneous I/O XCF32P 10/100/1000
Evaluation board is shown below followed by a brief description of each sub-section. LVDS Interface LVDS RX t t 10-bit data, frame, clock e EXP Slot e n n o o C C LVDS TX 10-bit data, frame, clock Configuration and Debug Ports System ACE Module Connector Platform Flash Miscellaneous I/O XCF32P 10/100/1000
HUS&HF E le k tr o n isc h e r M u sk e ls tim u la to r EMS-Gerät mit mehreren Behandlungsprogrammen Der Konzeption dieses Projekts wurden die Eigenschaften zugrunde gelegt, die professionelle Geräte aufweisen
******************************************************************** 2;* U S B S T A C K F O R T H E A V R F A M I L Y 3;* 4 5;* File Name :"USB90S2313.asm" ;* Title :USB stack + Infrared remote control to nonUSB MCU 6;* Date :5.4.2003 7;* Version :1.6 8;* Target MCU :AT90S2313-10,AT90S2323-10,AT90S2343
solder reflow profile for both package options is shown in Figure 8. t p ) CTp s Critical Zone: when e T is in the range r Ramp Up T to T g L p e (TL tL , e TSMax u t Ramp r Down e p m T TSMin tS Preheat 25 T = 25º C to T P Time, t (seconds) Figure 8 - FT232R Solder Reflow Profile The recommended values
solder reflow profile for both package options is shown in Figure 10. t p ) CTp s Critical Zone: when e T is in the range r Ramp Up T to T g L p e (TL tL , e TSMax u t Ramp r Down e p m T TSMin tS Preheat 25 T = 25º C to T P Time, t (seconds) Figure 10 - FT232R Solder Reflow Profile The recommended values
byte (address 000E) CH-D RX <CRC16> CRC of address, data byte RX 0Ch read-back for simple verification TX 0Dh next data byte (address 000Fh) RX <CRC16> CRC of address, data byte RX 0Dh read-back for simple verification
the appropriate parameters. Rev. 0 | Page 20 of 44 ADF7020 FREQUENCY CORRELATOR SLICER where: I IF E E Rx DATA DEMOD_CLK is as defined in the Register 3—Receiver Clock I N LIMITERS S F TO Register section,Note 2. P O DH K = Round(200e3/FSK Deviation) Q E N Rx CLK IF –DEV IF +DEV D S 0 6 To optimize
solder reflow profile for both package options is shown in Figure 10. t p ) CTp s Critical Zone: when e T is in the range r Ramp Up T to T g L p e (TL tL , e TSMax u t Ramp r Down e p m T TSMin tS Preheat 25 T = 25º C to T P Time, t (seconds) Figure 10 - FT232R Solder Reflow Profile The recommended values
/15 DS1821 Example:CPUsetsupDS1821forlowtemplimitof+10⋅Candhightemplimitof+40⋅C,outputactivehigh(i.e.,DQpin is off), then instructs the DS1821 to become a thermostat. DATA (LSB DQ PORT PIN FIRST) COMMENTS TX Reset Reset pulse (480–960 s). RX Presence Presence pulse. TX 01h CPU issues Write TH command
Y N DEVICE BUSY Y CONVERTING MEMORY TEMPERATURE BUSY ? ? MASTER MASTER MASTER MASTER R “0”S R “0”S RX “1”S X RX “1”S X 15 of 27 DS18S20 MEMORY FUNCTIONS FLOW CHART Figure 9 (cont’d) B4h B8h N N RECALL READ E2 POWERSUPPLY ? ? Y Y DS18S202RECALLS FROM E PROM Y Y MASTER TX MASTER TX RESET RESET ? ? N N N DEVICE Y N PARASITE Y MASTER N BUSY CONVERTING TEMPERATURE POWERED TXRESET ? ? ? Y MASTER MASTER RX “1”S RX“0”S MASTER MASTER RX “1”S RX“0”S 16 of 27 DS18S20 INITIALIZATION PROCEDURE “RESET AND PRESENCE PULSES” Figure 10 MasterXT "reset pulse" Master X 480µs minmum 480µs minmum 960µs maximum DS18S20
TEMPERATURE ? ? MASTER DISABLES MASTER DISABLES Y STRONG PULLUP Y STRONG PULLUP MASTER MASTER MASTER MASTER RX“0s” RX“1s” RX“0s” RX“1s” B4h BEh 4Eh N READ N B8h N N POWER SUPPLY RECALL E2 READ WRITE ? SCRATCHPAD SCRATCHPAD ? ? ? Y Y Y Y MASTER TXTHBYTE TO SCRATCHPAD N Y MASTER R XATA BYTE PARASITE FROM SCRATCHPAD POWERED MASTER BEGIN2 DATA ? RECALL FROM E PROM MASTER T X LYTE TO SCRATCHPAD MASTER MASTER MASTER Y RX“1s” RX“0s” TXRESET ? MASTER TXCONFIG. BYTE DEVICE TO SCRATCHPAD BUSY RECALLING N N DATA ? N Y HAVE 8 BYTES BEEN READ ? MASTER MASTER Y R “
TEMPERATURE ? ? MASTER DISABLES MASTER DISABLES Y STRONG PULLUP Y STRONG PULLUP MASTER MASTER MASTER MASTER RX“0s” RX“1s” RX“0s” RX“1s” B4h BEh 4Eh N READ N B8h N N POWER SUPPLY RECALL E2 READ WRITE ? SCRATCHPAD SCRATCHPAD ? ? ? Y Y Y Y MASTER TXTHBYTE TO SCRATCHPAD N Y MASTER R XATA BYTE PARASITE FROM SCRATCHPAD POWERED MASTER BEGIN2 DATA ? RECALL FROM E PROM MASTER T X LYTE TO SCRATCHPAD MASTER MASTER MASTER Y RX“1s” RX“0s” TXRESET ? MASTER TXCONFIG. BYTE DEVICE TO SCRATCHPAD BUSY RECALLING N N DATA ? N Y HAVE 8 BYTES BEEN READ ? MASTER MASTER Y R “
Connections for four standard LCDs ....................... 27 3.4.1 Connections to Sharp LM64183P (640 x 480 DSTN MONO LCD) ..............................27 3.4.2 Connections to PLANAR EL (640 x 480 AD4 EL)..................................................28 3.4.3ConnectionstoToshibaLTM10C042 (640 x 480 TFT
ist aber möglich) ; - einem lc-display dessen 8 datenleitungen 1 zu 1 an portb, steuerleitung lcd_e an ; portd pin 5 und lcd_rs an portd pin 4 angeschlossen ist; portb wechselt dann ; regelmäßig die datenrichtung (bei unbenutztem lc-display immer alles eingänge), ; die beiden steuerpins lcd_e und lcd_rs
