Version 74HC4851D -40 °C to +125 °C SO16 plastic small outline package; 16 leads; SOT109-1 74HCT4851D body width 3.9 mm 74HC4851PW -40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; SOT403-1 74HCT4851PW 16 leads; body width 4.4 mm 74HC4851BQ -40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal SOT763-1 enhanced very thin quad flat package; no leads; 74HCT4851BQ 16 terminals; body 2.5 × 3.5 × 0.85 mm 5. Functional diagram
. oANGE PART NUMBER ( C) PACKAGE ject • Significant Power Reduction Compared to LSTTL Logic ICs CD54HC164F -55 to 125 14 Ld CERDIP High peed • HC Types CD54HC164F3A -55 to 125 14 Ld CERDIP MOS - 2V to 6V Operation CD74HC164E -55 to 125 14 Ld PDIP ogic - High Noise Immunity: N IL= 30%, N IH= 30% of VCC at VCC = 5V CD74HC164M -55 to 125 14 Ld SOIC -Bit • HCT Types CD54HCT164F3A -55 to 125 14 Ld CERDIP erial- - 4.5V to 5.5V Operation n/Par- CD74HCT164E -55 to 125 14 Ld PDIP - Direct LSTTL Input Logic Compatibility, llel
2 2 L L 2 2M M M 2 2 N N2 2 2 P P G G H H J J K K K L L M M N N N GND GND VCORE 1 1 1 1 1 1 1 1 1 HC10 HC11 HC12 HC13 HC14 HC15 HC16 HC17 HC18 10UF/6.3V 10UF/6.3V 10UF/6.3V 10UF/6.3V 10UF/6.3V 10UF/6.3V 10UF/6.3V 10UF/6.3V 10UF/6.3V 2 2 /CAP/X 2 2 2 /CAP/X 2 /CAP/X 2 /CAP/X 2 2 /CAP/X A A GND <Variant
current please use an external transistor. EXTENDEDOUTPUTS It is possible to connect 1 to 32 chips like 74HC4094 to the eDIP (OUT1...OUT3), this is why it is attainabletohave8to256additionaloutputs.Thecommand"ESCYEn1n2n3"(seep.16)provides a comfortable way to control the outputs. Page 8 Printing and typographical
WITH SAME TYPE 6A, 125V FUSE. ATTENTION F5401: UTILISER UN FUSIBLE DE RECHANGE DE MÊME TYPE DE 1.25A, 250V. F5402: UTILISER UN FUSIBLE DE RECHANGE DE MÊME TYPE DE 6A, 125V. About lead free solder / 無鉛ハンダについて All of the P.C.B.s
T 26 82 R602 T 39 32 C202 T 157 50 C612 T 44 13 C812 T 20 59 C923 T 74 65 C1418 T 47 108 L401 T 69 16 R124 T 22 84 R603 T 38 32 C203 T 155 50 C613 T 44 15 C813 T 16 59 C924 T 149 66 C1419 T 39 75 L402 T 183 24 R125 T 25 82 R604 T 39 30 C204 T 138 53 C614 T 37 14 C814 T
AVDD_18V - + - + - + - + DVDD_18DVVDD_33V RJ45_LINK R12 512 3 3 2 2 2 2 2 1 1 1 1 1 8 6 4 2 VREF U3A 74HC04 C29 C18 W X M X D 0.1uF SPD0_LED 1 2 R E _ D I S 2 C 2 O U3B 0.1uF # K U5 4 4 4 4 4 4 4 4 4 3 3 3 3 3 3 3 C20 G S 3 0 0 D 0 0 1 3 1 1 D 1 1 1 LNK0_LED 3 4 E R D X X N X X D D X X N X X D JP5 R G D R R A T T D D R R A T T D VCNTL 49 G B A A A A 32 74HC04 0.1uF FX_SD 1 VREF 50 VCNTL B TEST1 31 DVDD_33V 51 VREF DGND 30 PWRST# FX_SD_TEST X1 52 DVDD33 PWRST# 29 EECS C24 R15 R16 X2 53 X1 EECS 28 EECK 0.1uF 54 X2 EECK 27 EEDIO 49.9/1% 49.9/1% LNK1_LED
Input unit eee eee eee e e e e e e h h 6-3 6.2.4 Interchanging input unit .......eeeeeeeecereeeeecee O74 6.2.5 Fuses Pe eeeeee ee 6-4 6.3 Trouble shooting e e e e 6-5 7. SAFETY INSPECTION AND TESTS AFTER REPAIR AND MAINTENANCE IN THE PRIMARY CIRCUIT 7-1 7.1 General directives 2.2.02 ceecsccceccesecceseseseens
..................................... (Eq. 4-33) (2eB·δ ⁄ (δ-1)·(Ik+2Id))1/2 . . . where I k η P λ/hc, and each symbol stands for the following: Ik:cathode current (A) e: electron charge (C) λ:wavelength (m) h: Planck's constant (J·s) c:velocity of light (m/s) η: quantum efficiency P: input light amount
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