-
PDF
Class_1_Bluetooth_Module_with_EDR_Support_DS500022-2257897.pdf
USB (HCI only) data connection interfaces • Sustained SPP data rates: 240 Kbps (Peripheral mode), 300 Kbps (Central mode) • HCI data rates: 1.5 Mbps sustained, 3.0 Mbps burst in HCI mode • Embedded Bluetooth stack profiles include: GAP, SDP, RFCOMM, L2CAP protocols, with SPP, HID and DUN profile support
in „[V] Microchip Bluetooth Module RN41-I/RM und RN42-I/RM“ · Markt ·
-
PDF
Class_2_Bluetooth_Module_with_EDR_Support_DS500023-2256355.pdf
USB (HCI only) data con- nection interfaces • Sustained SPP data rates: 240 Kbps (Peripheral mode), 300 Kbps (Central mode) • HCI data rates: 1.5 Mbps sustained, 3.0 Mbps burst in HCI mode • Embedded Bluetooth stack profiles include: GAP, SDP, RFCOMM, L2CAP protocols, with SPP, HID, and DUN profile support
in „[V] Microchip Bluetooth Module RN41-I/RM und RN42-I/RM“ · Markt ·
-
PDF
SARA-G3-U2_SysIntegrManual__UBX-13000995_.pdf
RESERVED pin Internally not connected. Leave unconnected. SARA-G350 See section 2.9 SARA-U2 RSVD SARA-G300 16, 23, N/A RESERVED pin Pin disabled. Leave unconnected. SARA-G310 25-27, See section 2.9 34-37 RSVD SARA-G300 44-49 N/A RESERVED pin Leave unconnected. SARA-G310 See section 2.9 SARA-U2 RSVD SARA-G300
in „GSM-Modul (SIM908) nur analoge Ausgänge für Anruf?“ · HF, Funk und Felder ·
-
PDF
10350.pdf
MX[1:0]=’01’ or ‘11’ FREF_RANGE = 1 500 kHz MX[1:0]=’00’ or ‘10’ FREF_RANGE = 0 Stable Input Clock 300 µs Stable V , V t PLL lock time 33IOPLL 18 LOCK1 FREF_RANGE = 1 Stable Input Clock 600 µs Stable 33IOPLLV18 tPLL= 4 MHz, MX[1:0]=’11’ ∆tJITTER1 PLL jitter (peak to peak) Global Output division = 32
in „ARM7TDMI 32-bit RISC CPU - STR 712 FR2 T6 zu verkaufen“ · Markt ·
-
Datei
NTC.html
); transform:scale(1); -webkit-transition-delay:0; transition-delay:0; -webkit-transition-duration:300ms; transition-duration:300ms; -webkit-transition-property:opacity, -webkit-transform; transition-property:opacity, -webkit-transform; transition-property:opacity, transform; transition-property:opacity
in „NTC auto kalibrierung - Matheformel“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
DAC8562_3.pdf
Voltage vs Temperature Figure 3. Internal Reference Voltage, Temperature Drift Histogram 2.510 400 ) p 300 ( i 2.505 S 200 e V a 100 T o U 2.500 V 0 E c R n V e−100 e 2.495 l−200 a e n−300 16 units shown (8 MSOP, 8 SON-10) I Average shown in dashed line 2.490 −400 −20 −15 −10 −5 0 5 10 15 20 0 250 500 750
in „Problem mit Positionsrückmeldung bei GRBL“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
ag172d.pdf
R108 NC 47 LVA3M RXE3- 23 24 RXE3+ LVA3P NC NC NC NC NC 2 VLCD_12V R109 NC 48 25 26 49 27 28 50 29 30 IL-FHR-B50S-HF (JAE) VLCD 2 VLCD 2 CONN L703 CN7 CN8 CN9 RP1R88 R89 R91 Table 1 Table 1 R90 R92 R93 R94 R95 R96 R97 BEAD 120OHM LVDS Panel X X V X X X X X 5V 5V 5V 1 RSDS Panel V V X V V V V V AU 17 NC
in „Geplatzte 25V-Elkos im 12V-Netzteil gegen 16V Low ESR austauschen?“ · Analoge Elektronik und Schaltungstechnik ·
-
Datei
IntLib.txt
Hitachi_Semiconductor_Legacy\Hitachi Semiconductor\Hitachi Microprocessor 16-Bit.IntLib AltiumLive\Legacy\IL_Switch_Legacy\IL Switch\IL Switch Push Button.IntLib AltiumLive\Legacy\Infineon_Legacy\Infineon\Infineon Discrete BJT.IntLib AltiumLive\Legacy\Infineon_Legacy\Infineon\Infineon Discrete Diode.IntLib
in „Altium 5.1.x Offline Libs“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
SSD1327_1.2.pdf
o Min COM pad pitch : 28um SSD1327Z 128 128 COG Page10 o Min I/O pad pitch : 60um o Die thickness: 300 +/- 15um Solomon Systech Jul 2009P 8/65 Rev 1.2 SSD1327 4 BLOCK DIAGRAM Figure 4-1: SSD1327 Block Diagram V CI BGGND V DD V DD Regulator . r . COM63 RES# i . COM62 r . CS# e D . | D/C# o o . E(RD#)
in „OLED Display mit SSD1327 Controller ansteuern“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
SSD1327-datasheet.pdf
5 DIE PAD FLOORPLAN Figure 5-1: SSD1327Z Die Drawing Pin 1 Die size 8.0 mm x 0.92 mm Die thickness 300 +/- 15um Min I/O pad pitch 60um Min SEG pad pitch 28um Min COM pad pitch 28um Bump height Nominal 15um Bump size Pad# X[um] Y[um] 1-28, 86-121 40 100 50 30 29-85 122-187, 322-387 16 100 188-321 16 94
in „OLED-Display SPI Psoc4“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
SSD1327-datasheet.pdf
5 DIE PAD FLOORPLAN Figure 5-1: SSD1327Z Die Drawing Pin 1 Die size 8.0 mm x 0.92 mm Die thickness 300 +/- 15um Min I/O pad pitch 60um Min SEG pad pitch 28um Min COM pad pitch 28um Bump height Nominal 15um Bump size Pad# X[um] Y[um] 1-28, 86-121 40 100 50 30 29-85 122-187, 322-387 16 100 188-321 16 94
in „OLED Stromverbrauch“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
AN1040.pdf
washer torque is necessary. Torque ratings apply when dry; flattens at about 50 pounds, whereas 150 to 300 pounds therefore, care must be exercised when using thermal is needed for good heat transfer at the interface. A very grease to prevent it from getting on the threads as useful piece of hardware is
in „2N3055 , was sind aktuelle Alternativen ?“ · Analoge Elektronik und Schaltungstechnik ·
-
PDF
AN1040_Freescale.pdf
washer torque is necessary. Torque ratings apply when dry; flattens at about 50 pounds, whereas 150 to 300 pounds therefore, care must be exercised when using thermal is needed for good heat transfer at the interface. A very grease to prevent it from getting on the threads as useful piece of hardware is
in „Lineares Netzteil“ · Analoge Elektronik und Schaltungstechnik ·
-
PDF
user.guide.hcmos.pdf
0.0000025 0.001 10 2 19 1.2 8.5 5.5 dynamic @100 kHz 0.075 0.1 10 2 19 1.2 8.5 5.5 static 0.000005 0.001 300 100 500 60 − 190 Counter dynamic @100 kHz 0.125 0.120 300 100 500 60 − 190 Propagation delay (ns) typical 8 94 40 10 9.5 3 4 1.5 3 Gate maximum 14 190 80 20 15 5 7 2.5 4 Delay/power product (pJ) 4 Gate
in „Unterschied 74HCxx, 74ACxx, 74LVCxx ?“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
user.guide.hcmos.pdf
0.0000025 0.001 10 2 19 1.2 8.5 5.5 dynamic @100 kHz 0.075 0.1 10 2 19 1.2 8.5 5.5 static 0.000005 0.001 300 100 500 60 − 190 Counter dynamic @100 kHz 0.125 0.120 300 100 500 60 − 190 Propagation delay (ns) typical 8 94 40 10 9.5 3 4 1.5 3 Gate maximum 14 190 80 20 15 5 7 2.5 4 Delay/power product (pJ) 4 Gate
in „74HCT Ausgangsstrom“ · Analoge Elektronik und Schaltungstechnik ·
-
PDF
Spezifikation.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „SPI, ISP, USI, TWI, I2C“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
Spezifikation.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
-
PDF
Spezifikation.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „I²c mit Bascom und ATmega“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
Spezifikation.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „Reset auf I2C-Bus“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
Philips_Semiconductors_-_I2C_Bus_Specification_v2.1.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „GND-Fäche sinnvoll???“ · Platinen ·
-
PDF
Spezifikation.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „i2c und Takt“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
Spezifikation.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
-
PDF
Spezifikation.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „I2C Speicher HotSwap?“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
Spezifikation.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „I²C Bus Schnittstelle extern ?“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
I2C_BUS_SPECIFICATION_3.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „SPI oder TWI“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
Spezifikation.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „Unterschied Defintion I²C und SPI“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
i2c_bus_specification_3.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „IIC-Bus Verständnisfrage“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
I2C_SPEC.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „I2C abstrakt“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
I2C_SPEC.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „I2C programmieren lernen“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
39340011.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „Problem mit I²C-Device“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
I2C_SPEC.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „was bedeutet acknowleges bei SPI“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
philips_i2c.pdf
set-up time t 250 − 100(4) – ns SU;DAT Rise time of both SDA and SCL signals tr – 1000 20 + 0.1Cb(5) 300 ns (5) Fall time of both SDA and SCL signals tf – 300 20 + 0.1Cb 300 ns Set-up time for STOP condition t 4.0 – 0.6 – s SU;STO Bus free time between a STOP and tBUF 4.7 – 1.3 – s START condition Capacitive
in „wie sieht ein i2c protokoll aus?“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
nRF2401rev1_1.pdf
Operating Temperature -40 +27 +85 ºC Digital input pin V IH HIGH level input voltage VDD- 0.3 VDD V V IL LOW level input voltage Vss 0.3 V Digital output pin V OH HIGH level output voltage OH =-0.5mA) VDD- 0.3 VDD V V OL LOW level output voltage (OL=0.5mA) Vss 0.3 V General RF conditions fOP Operating frequency
in „Externe Antenne für Funkmodul TRW24G“ · HF, Funk und Felder ·
-
PDF
ths0842.pdf
= DDD = DRVDD = CLK = 3.6 V 10 A Low-level input current on digital inpAVDD = DDD = DRVDD = 3.6 V, IL (OE, STDBY, PWDN_REF, CLK) Digital inputs at 0 V 10 A CI Input capacitance 5 pF †IIHleakage current on other digital inputs (OE, STDBY, PWDN_REF) is not measured since these inputs have an internal pull-down
in „ADC - Wie schnell aktualisiert der? Ist ein Oszi möglich?“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
A300_25AA640A_25LC640A-MIC.pdf
Marking Information 8-Lead DFN-S (5x6x1 mm) Example: XXXXXXX 5LC640A XXXXXXX E/MF e3 XXYYWW 0728 NNN IL7 8-Lead MSOP (150 mil) Example: MSOP 1st Line Marking Codes XXXXXT 5LCAI Device std mark YWWNNN 7281L7 25AA640A 5ACA 25LC640A 5LCA 8-Lead PDIP Example: 25LC640A XXXXXXXX I/Pe3 1L7 T/XXXNNN YYWW 0728
in „SPI funktioniert nicht“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
Western_Digital_FD1791.pdf
i t - T M R - - 1 r - - T' -I l-TcYc-t "USER NEED NOT CONCERN HIMSelF C lL . J L OREDATATHEEFD 179'ilLARE CLOCK NOTE: T02~IN MFM ARSI lVALUES WORDS. RClK MAY BE INVERTED - - f T C D , t - -BOTH 'tIMES DOUBLE FOR e L K " 1MHz Itli,,~ ~ l - T C D l IdIe40n~ NOMINAL DIRCVOH--.JSTEP IN f~ "- _ _ DISKETTE
in „(S)uche FDC SAB 1791 02P“ · Markt ·
-
PDF
12f1840_programming_41439A.pdf
High-Voltage Program/Verify Mode requires the following steps: Entry and Exit 1. MCLR is brought toIL. 2. A 32-bit key sequence is presented on There are two different methods of entering Program/ Verify mode via high-voltage: ICSPDAT, while clocking ICSPCLK. The key sequence is a specific 32-bit pattern
in „PIC16LF1847 flashen mit ATmega / USBasp / Arduino Nano / ponyser?“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
AN-693.pdf
, 500,000 counts/ control system; this response exhibits excessive rise time sample; acceleration, 300,000 counts/sample/sample. These values gener- which indicates a sluggish system. The filter parameters ated a good small-signal step input for the reference system; other systems will require different
in „Einfacher Weg von Quadratursignal => Spannung für Position und Drehzahl“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
INA186.pdf
ENABLE IEN Leakage input current 0 V ≤ ENABLE ≤ VS 1 100 nA V IH High-level input voltage 0.7 × S 6 V V IL Low-level input voltage DDF Package 0 0.3 × S V V HYS Hysteresis 300 mV V IH High-level input voltage 1.35 5.5 V V IL Low-level input voltage YFD package 0 0.4 V V HYS Hysteresis 100 mV IODIS Output
in „INA186 Noise Problem“ · Analoge Elektronik und Schaltungstechnik ·
-
PDF
MS-17631_2.0.pdf
CB2 C10p25N0402 8 GND 11 O_SIDE_JD 5 M AGND_O O_SCB3FO C10p25N0402 16 VIN 12 CB13 O_SIDE_OUT_R LB7 300L300mA-0603 O_SIDE_OUT_RR 6 O_EARPHONE_L RB1 75R0603 O_EAR_L LB3 300L300mA-0603ONT_O_EARL 4 C10p25N0402 O_SIDE_OUT_L LB6 300L300mA-0603 O_SIDE_OUT_LL 1 4 O_EARPHONE_R RB2 75R0603 O_EAR_R LB2 300L300mA
in „In Circuit Programmierer für 8-pin 150mil SOIC PM25LD512“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
Exp_Meth_In_RF_Des--Wes_Hayward.pdf
insertion loss. The filler of Fig 3-1 such that power is not efficiently delivered has an insertion loss (IL) of about half a from the source, through the filter and to fied with regard to frequency domain re- sponse, illustrated with a low pass filter in dB at the highest frequency peak. IL is the output.
in „Literatur zum Selbstbau von Sendern und Empfängern“ · HF, Funk und Felder ·
-
PDF
MBI5040_Datasheet_V1.00-English.pdf
accuracy, - Between channels: <±1.5% (typ.); - Between ICs: <±3% (typ.) z Visual effect control GF: SOP24-300-1.00 - Patented S-PWM technology to improve refresh rate - 16-bit or 12-bit gray scale control - 8-bit dot-correction Thin Shrink SOP - 7-bit linear programmable output current gain z Error detection
in „TLC5940 (PWM driver) | Kauftip!“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
AD7302.pdf
5.5 V min/max IDD Both DACs Active and Excluding Load Currents V = 3.3 V V = V and V = GND DD IH DD IL @ 25°C 2.8 mA max Typically 2.3 mA @ T MIN to TMAX 3 mA max See Figures 6 and 7 V DD = 5.5 V VIH V DD and VIL GND @ 25°C 4.5 mA max Typically 2.8 mA @ T MIN to TMAX 5 mA max See Figures 6 and 7 IDD (
in „(S) AD7302BNZ DAC DIP20“ · Markt ·
-
PDF
QN8027.pdf
output voltage 0.1*V IO V V IH High level input voltage 0.7*V IO V V Low level input voltage 0.4 V IL Notes: 1. RFO output at FCC level. Table 5: AC Characteristics (Vcc = 2.7 ~ 4.2 V,AT = -25 ~ 85 C, unless otherwise noticed. Typical values are at Vcc = A.3V and T = 25 C). SYMBOL PARAMETERS CONDITIONS
in „FM Transmitter - Antenne verstehen und messen“ · HF, Funk und Felder ·
-
PDF
AN262.pdf
standard mode I²C is not exceeded. Consider the V -reDDted input threshold of VIH 0.7 x V DD and V IL0.3 x V DD for the purposes of RC time constant calculation. -t /RC V(t) = V DD(1–1/e ) where t is the time since the charging started and RC is the time constant. V(t1) = 0.3 x VDD = V DD (1–1/e-t 1/
in „50 X LM75 an ATMEGA16?“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
Self-Resonance-in-Toroidal-Inductors.pdf
self-resonant frequency is given by the following equation (see Appendix 3): 0.5 Self-resonant Frequency f =r300 / [ 2 l path(μ’) ] MHz 4.1 Where l path= [(N lp) + (α le) ]0.5 N is the number of turns e is the length of the magnetic path in metres p is the length of the periphery of the ferrite cross section in
-
PDF
M95512.pdf
VCC V CC= 2.5V, VIN V SSorV CC 5 CC1 µA (Standby Power mode) S = VCC VCC = 5V, VIN V SSorV CC 5 V IL Input Low Voltage –0.45 0.3 VCC V V Input High Voltage 0.7 V V +1 V IH CC CC VOL Output Low Voltage IOL= 1.5 mA, VCC = 2.5 V 0.4 V VOH Output High Voltage IOH = –0.4 mA, VCC = 2.5 V 0.8 VCC V Note: 1
in „M95640-EEPROM per SPI an ATmega 8 antwortet nicht“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
MPR121.pdf
measurement duty cycle 1 mA Idle Supply Current DD Stop Mode 3 μA I , I Input Leakage Current ELE_ IH IL 0.025 μA Input Self-Capacitance on ELE_ 15 pF Input High Voltage SDA, SCL VIH 0.7 x DD V Input Low Voltage SDA, SCL VIL 0.3 x DD V Input Leakage Current IH,IL 0.025 1 μA SDA, SCL Input Capacitance SDA
in „Probleme bei I2C-Verbindung mit MPR121 unter BASCOM“ · Mikrocontroller und Digitale Elektronik ·
-
PDF
cs5460.pdf
V XIN (VD+) - 0.5 - - V SCLK 0.8 VD+ - - V Low-Level Input Voltage All Pins Except XIN and SCLK V IL - - 0.8 V XIN - - 1.5 SCLK - - 0.2 VD+ High-Level Output Voltage I = +5 mA V (VD+) - 1.0 - - V out OH Low-Level Output Voltage Iout= -5 mA VOL - - 0.4 V Input Leakage Current Iin - ±1 ±10 µA 3-State
in „Leistung messen an 230V von 1W bis 2000W“ · Analoge Elektronik und Schaltungstechnik ·
-
PDF
MCP73871-Data-Sheet-20002090E__2_.pdf
1.5 k in Series with 100 pF)4 kV Machine Model (200 pF, No Series Resistance).............300V DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits ap= V for+ 0.3V to 6V, T = -40°C to +85°C. IN REG A Typical values are at +25°CIN= [REG (typical) + 1.0V] Parameters
in „Fehlersuche beim MCP73871“ · Mikrocontroller und Digitale Elektronik ·