Write Pulse Width tWP 75 ns 3 Address Setup Time tAW 0 ns tWR1 0 ns 12 Write Recovery Time t 10 ns 13 WR2 Output High-Z from WE ODW 35 ns 5 Output Active from WE OEW 5 ns 5 Data Setup Time t 40 ns 4 DS Data Hold Time tDH1 0 ns 12 tDH2 10 ns 13 4 of 9 NOT RECOMMENDED FOR NEW DESIGNS DS1220Y READ CYCLE
Clock Biasing/ MII MII Circuit Power Management Block Block Register Control Final 1 Version: DM9161-DS-F05 September 10, 2008 DM9161 10/100Mbps FastEthernetPhysicalLayer TX/FXSingleChipTransceiver TableofContents 1. General Description..............................................3 7.2.13 Reduced Transmit
. If 'd' is 1, the result is stored back in register 'f'. Cycle 1 Example COMX REG1, 0 B : REG1 =0x13 A : REG1 =0x13, W =0xEC DS-TM56M152A_E 76 Rev 0.96, 2024/05/16 TM56M152A Data Sheet DECX Decrement "f" Syntax DECX f [,d] Operands f : 000h ~ 1FFh, d : 0, 1 Operation (destination) ← (f) - 1 Status Affected
Continued) 0 0 1 Handling5V Analog Inputs Read-Only Interface A C 0 0 2 A D 0 8 3 A D 0 8 4 A D 0 8 DS005671-34 DS005671-33 *Beckman Instruments 694-3-R10K resistor array µP Interfaced Comparator with Hysteresis Protecting the Input DS005671-9 Diodes are 1N914 DS005671-35 13 www.national.com 5 8 0 Typical
Snubberless™ C = 25 mA standard CW = 35 mA Snubberless™ SW = 10 mA logic level Packing mode RG = Tube DS2114 - Rev 11 page 13/18 T1610, T1635, T1650, BTA16, BTB16 Ordering information Figure 17. Ordering information scheme (T8 series) T 16 35 - 600 G (-TR) Triac series Current 16= 16 A Sensitivity 10 =
(nC) DS G Fig 5. Typical Capacitance vs. Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage Drain-to-Source Voltage 1000 1000 OPERATION IN THIS AREA LIMITED BY R (on) DS ) ) t t n 100 TJ= 175°C n 100µsec
9 on page 13) (1) ID= 0.2 A; VIN= 300 V tr Rise time (See Figure 9 on page 13) 50 ns COSS Drain capacitance V DS= 25 V 40 pF 1. On clamped inductive load Table 4. Supply section Symbol Parameter Test conditions Min
converter, the EN voltage must be less than 20% of the V voltage. IN 2011 Microchip Technology Inc. DS22234B-page 13 MCP1640/B/C/D NOTES: DS22234B-page 14 2011 Microchip Technology Inc. MCP1640/B/C/D 5.0 APPLICATION INFORMATION 5.3 Input Capacitor Selection The boost input current is smoothed by the
: MIC2915x Ground Current FIGURE 2-12: MIC2915x Ground Current vs. Input Voltage. vs. Temperature. DS20005685B-page 10 2016-2019 Microchip Technology Inc. MIC2915X/30X/50X/75X FIGURE 2-13: MIC29151-xx/2 Enable FIGURE 2-16: MIC29152/3 Adjust Pin Current vs. Temperature. Current vs. Temperature. FIGURE
wodurch der Entwicklung U3 12 Zeitkondensatorkreis von der Startschaltung getrennt wird. –(11-9) – 13,5–14,5 T1 (11-9) – 12 13,5–14,5 – Der Kondensator entlädt sich über den im Stromstabilisatorkreis T2 angeschlossenen Transistor T29-U3. Die Entladerate des (10,5-11,5) – –(10,1–11,1) – (11,0–10,4) –
current I (5) 0.8 A OS(5) Maximum sink current IOSI 1 A Gate drive pull-up resistance R V = 1V 8 Ω UP DS HS gate drive pull-down resistance RHS-DN V DS= 1V 1.2 4.3 Ω LS gate drive pull-down RLS-DN V DS= 1V 1 5 Ω resistance LS passive pull-down R LS-PDN 590 kΩ resistance LS automatic turn-on time LS At ENx
choice of low-side FET is a trade-off between P = 1 –- - - I 2 r (EQ. 10) conduction losses (r DS(ON) ) and cost. A good rule of thumb for Q2 VIN BAT DSON the rDS(ON) of the low-side FET is 2x the DS(ON) of the high-side FET. Choose a low-side MOSFET that has the lowest possible on- The LGATE
Current CC(ST) V CC= 13.5 V 2 − 3 −4.5 −2.5 −1.2 mA Startup Current Biasing V CC(BIAS) ICC−500µA 2 − 3 8.0 9.6 10.5 V Threshold Voltage Normal Operation Average Switching Frequency fOSC(AVG) 8 − 3 58 65 72 kHz Switching Frequency
supply board for the following circuit description. Alarm Sensing LED Indicators. LED indicators (DS2 through DS8 and DS13) are placed on the input voltage side of the Power Supply Supervisor, U9. These indicators provide a quick visual check to see if the expected input voltages to U9 are present if
primary controller on InnoSwitch3-EP is a Quasi-Resonant (QR) UNDER/OVER INPUT VOLTAGE (V) Pin (Pin 13) flyback controller that has the ability to operate in continuous A high-voltage pin connected to the AC or DC side of the input bridge conduction mode (CCM), boundary mode (CrM) and discontinuous for
Your Company GND Sheet: 1/1 Date: 2019-05-14 Drawn By: g3gg0.de 1 2 3 4 5 1 2 3 4 5 A VCC A R4 2k2 U9 DS18B20U+T&R TEMP_INT 1DQ VDD 2NC NC 3NC NC 4GND NC B B C C D D TITLE: Sheet_1 REV: 1.0 Company: Your Company Sheet: 1/1 Date: 2019-08-04 Drawn By: g3gg0.de 1 2 3 4 5 1 2 3 4 5 A A B B VCC5 VCC E13 E1 UDD32C05L01
data are ignored, and not displayed on the LCD screen. -19 of 28 - T6963C Application Notes Issue: 2/13/94 10.1.3 Example RAM Map for single screen drive LCD 0000H Graphic Ram Area (0000H-13FFH: 5120 bytes) 13FFH 1400H Attribute RAM Area 16FFH 1700H Text RAM Area (1700H-1BFF: 1280 bytes) 1BFFH 1C00H CG-RAM
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