MODE R D CD ±V D evaluation results for various test standards and methods based on Figure 1 MIL-STD-3015.7 Modified HBM 1.5kΩ 100pF 15kV are shown in Table 1. Standard HBM 1.5kΩ 100pF 6kV For the “Modified” MIL-STD-3015.7 condition that is defined as an “in-circuit” IEC 61000-4-2 HBM, Air Discharge 330Ω
Discharge 330Ω 150pF 8kV The SP724 has a Level 4 rating when tested to the IEC 61000-4-2 MIL-STD-3015.7 Modified HBM 1.5kΩ 100pF 8kV†▯ Human Body Model (HBM) standard and connected in a circuit in which the V+ and V- pins have a return path to ground. Level 4 specifies a Standard HBM 1.5kΩ 100pF 2kV
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Ordering Information Circuits Part number Circuits Part number Quantity per reel 10 XF2H-1015-1 30 XF2H-3015-1 1,500 per reel 12 XF2H-1215-1 32 XF2H-3215-1 13 XF2H-1315-1 33 XF2H-3315-1 Order in multiples of the quantity per reel. 14 XF2H-1415-1 34 XF2H-3415-1 18 XF2H-1815-1 35 XF2H-3515-1 20 XF2H-2015-1 36
neglected This model was introduced under MIL-STD models. This ESD event occurs when a 883 method 3015 where C O= 100pF and R X device slides down a tube, bag, or similar = 1.5kohm. Also commonly used is IEC source. This also can occur when 61000-4-2 where C O 150pF and R = X30 connecting the device
0,1 A 0,5 A M EM O: KAM3003 3,3 V 0.0 A 7,5 A KAM3005 5 V 0.0 A 6,0 A KAM3012 12 V 0.0 A 2,5 A KAM3015 15 V 0.0 A 2,0 A KAM3024 24 V 0.0 A 1,25 A KAM3012D 12 V 0.25 A 1,25 A - 12V 0,25 A 1,25 A KAM3015D 15 V 0.2 A 1,0 A - 15V 0,2 A 1,0 A KAM300503D 3,3 V 0.3 A 1,5 A 5V 0,3 A 3,0 A KAM300512D 5 V 0.6
IC3003 0 . 2 U 3 4 C C 3 N 2 N R N.U. R R2035 C 9 . R3037 11k 1k 0 . R3035 R N 27k C3021 15p 2 . 2 . R3015 0 C N 6 0 TP3010 TP3009 XL2001 0 0 XL2002 4 4 R3056 750 17.7MHz R 14.3MHz 3 0 7 0 7 0 R 4 R 4 2 Z2003 8 9 3 4 R R3062 R3064 NFE61PT472C1H 0 p 0 p 0 p 0 p 2 3 2 3 C 3 C 3 47-1/4 10-1/4 C C . IC3004 C3006
ESD Protected Per MIL-STD-883, Method A differential switching. The devices handle the needs of X 3015 Gigabit Ethernet (10/100/1000) Base-T switching as Single +3.0V to +3.6V Power-Supply Voltage 4 well as LVDS and LVPECL switching. The MAX4890E/ MAX4892E provide enhanced ESD protection up to Low On-Resistance
boards 1 6 COMPLIES WITH THE FOLLOWING STAN- DARDS: 2 5 IEC61000-4-2 : level 4 MIL STD 883C-Method 3015-6 : class3 3 4 (human body model) March 2000 Ed: 5D 1/7 ESDAxxSC5 / ESDAxxSC6 ABSOLUTE MAXIMUM RATINGS (T amb= 25°C) Symbol Test conditions Value Unit VPP ESD discharge - MIL STD 883C - Method 3015-
STANDARDS: IEC61000-4-2, level 4 ±15 kV (air discharge) ±8 kV (contact discharge) MIL STD 883E, Method 3015-7 Class 3 C = 100 pF R = 1500 3positivestrikesand3negativestrikes(F=1Hz) ABSOLUTE RATINGS (T amb = 25°C) Symbol Parameter Value Unit V PP ESD discharge IEC 61000-4-2, air discharge ±16 kV ESD discharge IEC 61000-4-2, contact discharge ±9 kV ESD discharge - MIL STD 883E - Method 3015-7 ±25 kV T j Maximum junction temperature 150 °C T Storage temperature range - 55 to +150 °C stg TL Lead solder temperature (10 second duration) 260 °C T op Operating temperature range 0 to 70 °C P
equipment against electrostatic A discharges according to IEC 61000-4-2, and MIL STD 883, method 3015, and electrical over stress according to IEC 61000-4-4 and 5. These K K devices are more generally used against surges below 600 W (10/1000 μs). Planar technology makes these devices suitable Unidirectional
244 LATCH-UP PERFORMANCE EXCEEDS 500mA (JESD 17) ESD PERFORMANCE: HBM > 2000V (MIL STD 883 method 3015); MM > 200V ORDER CODES PACKAGE TUBE T & R SOP 74LVC244AM 74LVC244AMTR TSSOP 74LVC244ATTR DESCRIPTION The 74LVC244A is a low voltage CMOS OCTAL BUS BUFFER (3-STATE) fabricated with
-2 level 4 discharges according to IEC 61000-4-2, and – 15 kV (air discharge) MIL STD 883, method 3015, and electrical over – 8 kV (contact discharge) stress according to IEC 61000-4-4 and 5. These devices are generally used against surges below ■ IEC 61000-4-5 (see Table 3 for surge level) 400 W (10/1000 μs). ■ MIL STD 883G, method 3015-7 Class 3B Planar technology makes these devices suitable – 25 kV HBM (human body model) for high-end equipment and SMPS where low ■ Resin meets UL 94, V0 leakage current and high junction temperature
2 level 4: discharges according to IEC 61000-4-2, and – 15 kV (air discharge) MIL STD 883, method 3015, and electrical over – 8 kV (contact discharge) stress according to IEC 61000-4-4 and 5. These devices are more generally used against surges ■ IEC 61000-4-5 below 600 W (10/1000 μs). ■ MIL STD 883G, method 3015-7 Class 3B: Planar technology makes these devices suitable – 25 kV HBM (human body model) for high-end equipment and SMPS where low ■ Resin meets UL 94, V0 leakage current and high junction temperature
low power consumption (1.65mW), and an ESD tolerance of 2000V (<5nA at +85°C) G minimum per Method 3015.7. The new design offers ♦ Withstand Electrostatic Discharge (2000V min) per Method 3015.7 4 lower off-leakage current over temperature (less than 5nA at +85°C). 4 Existing Features The DG441/DG442
PISS10114 PA6 PISS20114 PB10 PISS3014 PIUC1094 BOOT0 PE4 P I U C 1 0 3 NLPE5 PISS10115 PISS20115 PISS3015 PE5 P I U C 1 0 4 NLPE6 PC1 PISS10116 PA7 PISS20116 PB11 PISS3016 PE6 P I U C 1 0 5 PE6 C PO NRSTT NRSTS PIUC1014 NRST PE7 PIUC1038 PE7E7 SS11 SS2 2 SS33 C GND PIUC1020 VREF- PE8 PIUC1039 PE8E8 PB12
consumption, and an ESD Improved Charge Injection (10pC max) tolerance of 2000V minimum per Method 3015.7. The Improved Off-Leakage Current Over Temperature G (<5nA at +85°C) 4 new design offers low off-leakage current over temper- ature (less than 5nA at +85°C). Withstand Electrostatic Discharge (2000V min) 1 The DG417/DG418 are single-pole/single-throw (SPST) per Method 3015.7 8 switches. The DG417 is normally closed, and the / DG418 is normally open. The DG419 is single- __________________Existing Features D pole/double-throw (SPDT) with one normally closed Low R DS(ON
0,8 Ms 0,8 Ms 0,8 g/1000 450 480 440 440 420 600 640 700 710 Artikel Nr. 61-1889-11 61-1889-14 67-3015-11 61-1536-11 61-2410-11 61-3025-11 61-3025-14 61-1990-11 61-1991-11 b 1 l1 6,3 x 18 6,3 x 20 6,3 x 24 6,3 x 24 6,3 x 37 6,3 x 40,7 6,3 x 67,6 13 x 16 13 x 16 b 2 l2 1,4 x 4 1,3 x 4 1,4 x 5 1,4 x 5
Measured at 100Vdc) ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Lead Integrity MIL-STD-883, Method 2004 Mechanical
R Flatness over Specified Signal 2 consumption and ESD tolerance greater than 2000V per ON Method 3015.7 are guaranteed. Range (2Ω max) M The MAX312/MAX313/MAX314 are quad, single- ♦ Guaranteed ESD Protection > 2000V per Method A pole/single-throw (SPST) analog switches. The MAX312 3015.7 is normally
fast A switching (turn-on time less than 175ns and turn-off time ESD Guaranteed > 2000V per Method 3015.7 less than 145ns). Single-Supply Operation (+10V to +30V) X 3 The MAX351/MAX352/MAX353 are fabricated with Maxim’s Bipolar-Supply Operation (±4.5V to ±20V) new improved 44V silicon-gate process. Design
Supplier (μH) Current Rating (mA) (mΩ) (mm) Series TAIYO YUDEN 2.2 1480 60 3.00 x 3.00 x 1.50 NR 3015 GOTREND 2.2 1500 58 3.85 x 3.85 x 1.80 GTSD32 Sumida 2.2 1500 75 4.50 x 3.20 x 1.55 CDRH2D14 Sumida 4.7 1000 135 4.50 x 3.20 x 1.55 CDRH2D14 TAIYO YUDEN 4.7 1020 120 3.00 x 3.00 x 1.50 NR 3015 GOTREND
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